Prof. Roni Khazaka
Prof. Roni Khazaka
Prof. Roni Khazaka received his Bachelor, Master, and Ph.D. degrees in Electrical Engineering from Carleton University, Ottawa, Canada in 1995, 1998, and 2002, respectively. In 2002, he joined the Department of Electrical and Computer Engineering at McGill University, Montreal, QC, Canada, where he currently is an Associate Professor in the department of Electrical and Computer Engineering, and Associate Dean, Academic Program, in the Faculty of Engineering. Prof. Khazaka is a senior member of the IEEE. In 2009, he was a Visiting Research Fellow with the University of Shizuoka, Shizuoka, Japan. In 2017, he was a Visiting Researcher with the Politecnico di Torino, Turin, Italy. He has authored over 100 journal and conference articles in the areas of signal and power integrity, model order reduction, macromodeling and high frequency circuit simulations. His current research interests include signal and power integrity, electronic design automation, numerical algorithms and techniques, the analysis and simulation of RF ICs, and high-speed interconnects and packages.
Prof. Khazaka served as the General Chair and General Co-chair of EPEPS 2018 and 2019 as well as the International Conference on Analog VLSI circuits, AVIC 2013. He is a member and current Chair of the IEEE MTT-S Technical Committee on Design Automation TC-02. Prof. Khazaka served as Treasurer and as Chair of the IEEE Montreal Section. He is currently the Chair of the IEEE Montreal Section joint EMC/EPS Chapter which won the local best Chapter award in 2020. Prof. Khazaka has also served on several IEEE technical program and organizing committees.
Talk 1: EDA Best Practices for Signal and Power Integrity
Incorporating Signal and Power Integrity in the Electronic Design Automation workflow is now essential for high performance systems. In this talk we present an SP/PI aware design flow and some of the key challenges and solutions for incorporating SP/PI as an integral part of the design flow. Using practical examples of interconnect and package designs as well as on-chip power distribution networks, we present the key limitations of current design flow as well as the challenges that distributed passive components present to both the design as well as the simulation/design automation process. We present state-of-the-art tools and methodologies for SI/PI design.
Talk 2: Signal Routing and Transmission Lines
Signal routing at high frequencies is a key performance bottleneck. Interconnects present a significant challenge due to dispersion, reflection, and crosstalk. Other effects such as ground bounce, inductive effects and current return path, as well as electromagnetic interference must be also accounted for in the design process. Using practical design examples, we present key design and analysis bottlenecks, the theory behind these high frequency effects, and state-of-the-art approaches for mitigating them.
Talk 3: Noise in High Frequency Circuits
Noise performance is a key figure of merit in high frequency circuit design. In this talk we give an overview of state-of-the-art noise analysis techniques. We also provide insight into key figures of merits, and how to interpret them both at the system and circuit level. One key outcome of this talk is to provide insight on how best to take advantage of current state-of-the-art electronic design tools for noise aware circuit design.