Calls For Papers

L-EMCPA Call For Papers
T-EMC Call for Papers
Linked Special Issues –
“AI, Machine Learning, and Deep Learning: Advances and Applications for EMC”

Artificial Intelligence (AI) is almost ubiquitous. It’s something that most people have interacted with, knowingly with generative AI applications seeing common use, or unknowingly through such applications as customer segmentation activities. Equally, AI for science and engineering is gaining fresh traction. Not surprisingly, it is a topic that is seeing growing interest within the EMC and SIPI communities as evidenced by the increasing numbers of papers presented at conferences and within journals such as these.

The discussions within the EMC Society have clearly shown that there is a growing body of research on techniques and how they can be used, and a growing body of activity applying machine learning and AI to solve practical problems facing industry right now. The purpose of these linked special issues of the IEEE Transactions on Electromagnetic Compatibility (Transactions) and the IEEE Letters on Electromagnetic Compatibility Practice and Applications (Letters) is to provide a picture of the current state of the subject as it applies within our communities, and to do so in a way that captures original research and innovation (through the Transactions route) and applications and case studies (through the Letters route).

The IEEE EMC Society is seeking original, unpublished papers covering all aspects of EMC and technologies that are affected by EMC.

Join us in Phoenix (AZ). Share your insight, ask questions, learn from the experts/innovators and see new products at the 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity/Power Integrity. Your published paper will be seen by thousands in the EMC community and across the wide array of disciplines that look to the IEEE EMC Society for technical guidance. In addition, it will be uploaded to IEEE Xplore with the exposure and recognition that brings.