YP Ambassador
Gaurav Mahajan

Young Professional Ambassador

Gaurav Mahajan

Term 2026-2027

Module Camera EE Lead
Apple Inc.
Cupertino, CA


Gaurav Mahajan received a M.S. in Electrical Engineering from Stanford University, and a B.S. in Electrical and Electronics engineering from BITS Pilani. He has been working at Apple Inc since 2015 as Senior Design Engineer where his role involves architecting future camera technologies, researching and prototyping innovative ideas towards consumer electronics. Before his tenure at Apple Inc., he served as a Analog and Mixed Signal design engineer at Inphi Corporation (now Marvell Technology) from 2013 to 2015. Outside of work, he serves as Vice-Chair for the IEEE Consumer Technology Society in Bay Area, and has served as Young Professionals Chair of IEEE BuenaVentura sections in the past. He is a Senior IEEE Member, with presence in IEEE EMC chapters and conferences, which is a testament to his commitment to staying at the forefront of technological advancements while fostering collaboration among peers. He has contributed patents and publications in the field of electrical circuit and systems.

Talk: Grounds for Grounding

Abstract:

Grounding is a critical aspect of EMC. Good knowledge of grounding is critical for every single person interested in building reliable electronics. Grounds for Grounding delves into this topic by choosing selected materials from a book of same name by Elya B. Joffe and Kai-Sang Lock . It would dive into a comprehensive survey of grounding methods used in designing electrical and electronic circuits and systems. Intent is to combines theory and practical examples to show how a few fundamental principles can be applied to a wide range of situations. It will focus on introducing the foundational concepts of electromagnetic compatibility (EMC), including the often misunderstood concept of a “ground loop”. They then delve into the various types of grounding, including safety grounding, grounding for electromagnetic interference control, and case studies related to grounding. The main target is brings forth some essential understanding for electrical and electronic engineers who are working on designing the next generations of circuits, systems.

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