YP Ambassador
Aditya Rao
Young Professional Ambassador
Aditya Rao
Term 2026-2027
Qualcomm
San Diego, CA, USA
Aditya Rao (Member, IEEE) received his B.Sc. degree from Manipal University, Manipal, KA, India, in 2019, and his M.S. and Ph.D. degrees from the High-Speed Digital Engineering Group at the University of Colorado Boulder, Boulder, CO, USA, in 2021 and 2024, respectively. His research has focused on electrically characterizing printed circuit boards using in-situ structures and on establishing broadband measurement-simulation correlation, with publications in the IEEE Transactions on Instrumentation and Measurement, the IEEE Transactions on SPI, the IEEE EMC+SIPI Symposium, IEEE Conference on EPEPS, and DesignCon.
He is currently a Senior Engineer in the Power and Signal Integrity Group (PSIG) at Qualcomm in San Diego, CA, USA.
Talk 1: PCB Material Characterization for Measurement-Simulation Correlation
Abstract:
This talk provides an overview of some prominent laminate material characterization techniques that are crucial for evaluating laminate permittivity and losses. These techniques are compared and contrasted with newer in-situ methodologies that excel at extracting parameters that yield highly accurate measurement-simulation correlation, highlighting where they excel and where they fall short.
The talk also demonstrates some common phenomena that can lead to dispersion in the measured time delay and effective dielectric constant, namely anomalous dispersion from discontinuities and non-TEM dispersion in microstrip structures.
Talk 2: Measurement Artifacts in the Time and Frequency Domain
Abstract:
Measurements are often considered the gold standard in evaluating the signal integrity of transmission lines. However, the impact of measurement equipment on captured data is often overlooked, resulting in reflections, Gibbs’ ringing, and rise-time degradation. This talk covers common measurement artifacts observed when using Oscilloscopes, Time Domain Reflectometers (TDRs), and Vector Network Analyzers (VNAs) in both the time and frequency domains, providing additional insights into their root cause. Knowing about these artifacts helps with equipment selection and provides the expertise needed to anticipate, identify, and mitigate them before measurements are performed.