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EMI-EMC Hardware Engineer
L-3 Communication Systems
LOCATION: Salt Lake City, Utah
REPORTS TO: Manager, RF Subassemblies & EMI/TEMPEST Engineering
The EMI/EMC Hardware Engineer will be a critical member of the engineering team, providing EMI/EMC expertise and leadership in the design, development and verification of mission critical communication systems, including ground-based, mobile, satellite and intelligence, surveillance and reconnaissance (ISR), applications for L3’s military and government customers.
• Take a hands-on role in performing design and test activities as required during proposal, development and testing stages of a programs to ensure EMI compliance in PCB (printed circuit board) design.
• Apply engineering principles to investigate, analyse, plan, design, test and evaluate L3T products for Electromagnetic Environmental Effects (E3). Identify issues and recommend updates to meet product performance requirements.
•Support both system and sub-system development efforts and design reviews, including: sub-system partitioning, packaging, internal and external cable design, grounding/bonding and isolation requirements, Printed Circuit Board (PCB), and Circuit Card Assembly (CCA) layout recommendations, schematic development, grounding maps, trade studies analysis and simulation activities.
• Develop layout and routing constraints for PCB designs, including defining PCB layer stack-up, recommending components and connectors as required and performing final lay-out/route review of PCB. Assist with debug efforts of completed boards, as required.
• Perform PCB pre layout and post layout Signal Integrity Simulation using Mentor Hyperlynx, Mentor Power Integrity Analysis, Ansys HFSS and Agilent ADS simulation tools. Perform additional Interconnect analysis for Cables, Connectors, Backplanes, Power Supplies, etc.
• Mixed Signal design Simulations will include Analog, High Speed Analog, Power, Digital, SD Video and HD-SDI Video. RF Simulations to be performed include Signal Line Termination, Signal Line Overshoot/Undershoot, non-monotonic edges, Far End (FEXT) and Near End (NEXT) Crosstalk, Eye-Diagrams for Clocks and High Speed Serial, Ground Bounce, Power Decoupling, Power Distribution (PDN) Power Integrity DC Loss and noise margin, Signal Line and Bus loading and route topology, Routed Skew Management, Analog/Digital noise margin and RF Coupling.
• Perform EMI/EMC simulations with SPICE or other EMI/EMC simulation tools to predict CCA-level and system-level EMI performance, and understand anomalies observed during hardware testing.
• Prepare, conduct and participate in design reviews including Requirements, System Level, Schematic, Interconnect, Electrical and Mechanical, Test Readiness and internal/ external customer reviews.
• Create EMI control plans, test plans, test procedures, test reports and other applicable documents as required.
• Perform required EMI/EMC pre-test setup and calibration measurements prior to testing.
• Direct EMI testing activities and participate in EMI related system and sub-system troubleshooting efforts.
• Interface with other members of the program engineering team, manufacturing team and the customer as required to provide E3/EMI expertise, design, address issues and advance research.
• Interface with external suppliers to upgrade their products for EMI compliance, when necessary.
• Provide in-house training seminars and individual mentoring for other engineering disciplines, manufacturing personnel, management staff and customers on various aspects of EMI/EMC/E3 design.
• An ABET (EAC/CAC) accredited Bachelor of Science degree in Electrical Engineering is required, an advanced degree is preferred. Applicable work experience may be considered for degree equivalence.
• A minimum of five years relevant EMI/EMC engineering design experience, working with military/defense applications is required.
• A working knowledge of electromagnetic theory, radiated and conducted emissions, signal and power coupling effects, susceptibility of systems, Electromagnetic Interference (EMI), Electromagnetic Compatibility (EMC), Electromagnetic Environmental Effects (E3), Signal Integrity (SI), Lightning effects, EMP and HEMP is required.
• Experience with EMI/EMC design techniques for wide-band, high isolation performance, signal containment and cross-talk management, source suppression, Signal Line filtering and Power Filter Design, ESD and Lightning, grounding/bonding and return currents is required. Applicable for PCB’s, sub-assemblies, LRUs, interconnect cabling and system-level hardware for hand-held, aircraft, ground and shipboard systems and platforms.
• Knowledge and focus on designing for, and testing to MIL-STD-461, MIL-STD-464, ADS-37A and RTCA/DO-160 specifications is required.
• Knowledge of MIL-HDBK-419A, MIL-STD-188-124/125, MIL-STD-202, MIL-STD-220, MIL-STD-235, MIL-STD-285, MIL-STD-704, MIL-STD-1275, MIL-STD-1399, MIL-STD-1541, MIL-STD-1542, MIL-STD-2169, MIL-STD-3023, UK DEF-STAN 59-41 are beneficial, but not required
• Knowledge of commercial (FCC, CE-Mark, RTCA DO-160, IEEE-299) specifications and qualification testing is beneficial, but not required.
• Experience with assembling and troubleshooting EMI/EMC test setups is required.
• Experience with simulation of complex problems utilizing IBIS Models, SPICE Models, S11/S21 extracted parameters and other applicable models for Signal Integrity Simulation is required.
• Demonstrated experience developing layout and routing constraints for PCB designs is required. This includes Route Topology definition, Net Class/Net Property generation, and multi-Impedance layer Stack-up definition. In addition, knowledge of the partitioning of Mixed Signal designs including Analog, Control, Digital, Power and RF on a CCA will be required.
• Experience with common lab equipment, such as: oscilloscopes, Power Supplies, Audio Amplifier, Transformers, Line Impedance Stabilization Network (LISN), spectrum analyzers, EMI receivers, signal generators, RF amplifiers, EMI test antennas, Vector Network Analyzer (VNA), EMI Field Probes, EMI measurement and current injection probes is required.
• Experience in EMI test software, EMI shield rooms/chambers and associated maintenance is required. Experience with ETS TILE! Software is preferred.
• Willing to travel as required to customer or vendor locations to solve EMI issues.
• Ability to obtain a US security clearance is required, current clearance is highly preferred.
Marika Akers 503-761-7893 // email@example.com
Jennifer Silvester 801-999-4359 // Jennifer@silvesco.com