SC-1 Advanced Packaging and Photonics: SI/PI and EMC

This special committee will address emerging SI, PI, and EMC challenges driven by the rapid growth of AI, advanced packaging, and photonics. The scope includes all aspects of conventional organic packaging, 2.5D/3D/3.5D advanced packaging, panel level packaging (glass), devices and interconnects for SiPh, VCSEL and microLED. The committee will provide a dedicated forum for industry and academia to identify technical needs, share solutions, promote education and collaboration, and support standards and technology-roadmap activities within the EMC Society’s Field of Interest.