L-EMCPA Call For Papers

Scope:

IEEE Letters on Electromagnetic Compatibility Practice and Applications (L-EMCPA) is a rigorously peer-reviewed forum for rapid publication of articles describing practice, lessons learned and applications of the disciplines electromagnetic compatibility (EMC) and signal and power integrity (SIPI) as well as all relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity.

IEEE Letters on Electromagnetic Compatibility Practice and Applications #LEMCPA, is going to publish a dedicated issue on EMC Testing and Qualification. In particular, we are looking for 4 page letters that present and discuss: 
• practical experiences in EMC Testing and Qualification.
• applications of EMC Testing standards
• recommended good practice 

Authors are invited to submit manuscripts up to 4 pages in length, including title, author’s affiliation, abstract, take home messages and figures via https://lnkd.in/dcGYfbG. A template is available below.

Paper submission deadline: 1 June 2022
Planned publication date:     December 2022

• EiC L-EMCPA: Dr.-Ing. habil Frank Sabath (sabath@geml.uni-hannover.de)

• L-EMCPA on IEEE Xplore

• Letter/paper submission via https://mc.manuscriptcentral.com/l-emcpa-ieee

• Letter Template Download

• Recent Call-for-Letters