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DTSTART;TZID=America/New_York:20260922T220000
DTEND;TZID=America/New_York:20260922T233000
DTSTAMP:20260630T192515Z
CREATED:20260630T185707Z
LAST-MODIFIED:20260630T192515Z
UID:10000085-1790114400-1790119800@www.emcs.org
SUMMARY:EMC Society Distinguished Lecturer Series: From PDN Ecology to 3D Heterogeneous Systems: Robust PI Design for Chiplets
DESCRIPTION:From PDN Ecology to 3D Heterogeneous Systems: Robust PI Design for Chiplets \nSpeaker Bio:\nProfessor Si-Ping Gao\nFull Professor\, Nanjing University of Aeronautics and Astronautics (NUAA) \nAbstract:\nChiplet-based architectures introduce unprecedented complexity into the power delivery network (PDN) ecology\, extending the supply path across multiple physical domains—from the voltage regulator module (VRM) to the board\, package\, interposer\, micro-bump arrays\, and finally to the on-die power rails. Building on an impedance-centric design philosophy\, this lecture begins by clearly defining the chiplet PDN as a multi-layer ecosystem whose performance is determined not by isolated components\, but by the impedance profile presented to the die. Fundamental concepts—including target impedance\, transient current spectra\, PDN ratio\, and the interaction between switching activity and impedance peaks are reviewed and extended to the heterogeneous integration context. The lecture highlights why chiplet systems are particularly susceptible to simultaneous switching noise\, return-path discontinuities\, and rogue-wave–type voltage collapses. \nBuilding upon these principles\, the lecture introduces practical methodologies for shaping the chiplet PDN impedance profile by eliminating avoidable resonances\, minimizing spreading inductance\, and engineering low-mounting-inductance decoupling strategies. Through realistic case studies—including interposer-level IR-drop benchmarking\, PDN layer co-design\, and multi-chip transient simulations—the session demonstrates how frequency-domain impedance targets translate into time-domain voltage-noise performance. Advanced topics such as hybrid simulation–measurement workflows\, AI-assisted PDN optimization\, and the construction of chiplet-level target impedance curves are also discussed. The lecture concludes by outlining a robust design process that balances performance\, cost\, schedule\, and risk\, equipping engineers with the analytical intuition needed to achieve predictable\, repeatable\, and EMC-compliant power delivery in next-generation heterogeneous systems. \nSpeaker Bio:\nProfessor Si-Ping Gao is a Full Professor at the Nanjing University of Aeronautics and Astronautics (NUAA)\, where he also serves as Director of the Center for Advanced RF IC and System (C-ARFIS). He has more than 15 years of research and development experience in electromagnetic compatibility (EMC)\, signal and power integrity (SI/PI)\, and high-speed electronic systems. Prior to joining NUAA\, he held research and engineering positions at A*STAR IHPC\, National University of Singapore\, and AMD\, gaining extensive experience across academia\, national research institutes\, and industry. His work bridges fundamental electromagnetic theory with practical system-level design for advanced electronics and heterogeneous integration. \nProf. Gao received his B.Eng.\, M.Eng.\, and Ph.D. degrees from NUAA and was a PhD exchange scholar at Nanyang Technological University\, Singapore. He has authored over 100 refereed journal and conference publications and holds multiple patents. His research contributions span computational electromagnetics\, EMC/EMI modeling\, SI/PI for high-speed and chiplet-based systems\, ferrite-based frequency selective limiters\, novel shielding materials\, and on-chip plasmonic interconnects. His work has been widely recognized through numerous best paper awards and international distinctions. \nProf. Gao is a Senior Member of IEEE and an active contributor to the IEEE Electromagnetic Compatibility Society. He is the recipient of the IEEE EMC-S Young Professional Award (2021) and has been recognized as a Distinguished Reviewer of IEEE Transactions on EMC. He has served the EMC community in multiple leadership roles\, including Chair of the IEEE EMC Singapore Chapter\, under whose leadership the chapter received the IEEE EMC-S Chapter-of-the-Year Award. He has also played key roles in organizing major international conferences as TPC Chair\, Technical Paper Chair\, and Guest Editor\, and is a frequent invited speaker and educator in EMC\, SI/PI\, and advanced RF systems. \n. \nDate: Tuesday\, September 22\, 2026 \nTime: 10:00pm – 11:30pm (EDT)\n(10:00am – 11:30am on Wed Sept. 23 at Singapore Standard Time)
URL:https://www.emcs.org/event/emc-society-distinguished-lecturer-series-from-pdn-ecology-to-3d-heterogeneous-systems-robust-pi-design-for-chiplets/
CATEGORIES:EMC SOCIETY DISTINGUISHED LECTURER WEBINAR
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/06/DL_SiPingGao480x270.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20261007T160000
DTEND;TZID=America/New_York:20261007T173000
DTSTAMP:20260630T194536Z
CREATED:20260630T191222Z
LAST-MODIFIED:20260630T194536Z
UID:10000086-1791388800-1791394200@www.emcs.org
SUMMARY:EMC Society Distinguished Lecturer Series: Electric Vehicle Powertrain: Challenges for EMC – HV EMC Filter for Compliance of Electric Vehicles
DESCRIPTION:Electric Vehicle Powertrain: Challenges for EMC – HV EMC Filter for Compliance of Electric Vehicles \nSpeaker Bio:\nDr. Guido Rasek\nMaster Expert & EMC Architect\nValeo eAutomotive Power Division Erlangen\, Germany \nAbstract:\nNoise currents in High-Voltage Power Trains of Electric Vehicles place significant strain on the EMC filters used to mitigate conducted and radiated emissions. Filtering targets for high level emissions must be achieved. The power dissipation caused by the resistive properties of the filter components is a key factor in determining the temperature behaviour and lifetime of the filter. Validated numerical EMC computer modelling and robustness evaluations of HV Filters of the Electric Vehicle Power Train are part of the development targets. Principle outlines of the activities to achieve postulated goals are presented. The key take away is a broad view beyond the obvious on the daily challenge of EMC in the automotive High Voltage Vehicle Electrification. \nSpeaker Bio:\nDr. Guido Rasek is an internationally recognized expert in Electromagnetic Compatibility (EMC) with over 25 years of experience in the automotive and aerospace industries. He currently serves as Master Expert and EMC Architect at Valeo eAutomotive (VeA) Power Division\, leading global EMC initiatives for electric powertrains\, including high-profile eAxle and inverter projects in Europe and China. His work spans the entire product development cycle\, from specification and design to verification\, and includes technical leadership\, international project management\, and advanced EMC strategy development. \nDr. Rasek has held senior roles at Robert Bosch GmbH and led EMC operations at his own company\, EMCCons Dr. Rasek GmbH\, where he developed innovative testing methods for aerospace applications. He has successfully mentored and supervised student research up to Ph.D. level\, developed EMC training programs\, and steered the EMC domain for major OEM contracts worldwide. His contributions have been recognized with the IEEE EMC Society Richard Schulz Transactions Prize Paper Award and numerous peer-reviewed publications in high-impact journals and international conferences. \nIn addition to his industrial work\, Dr. Rasek is a dedicated academic lecturer\, teaching EMC in Electrical Drives for Electric and Hybrid Vehicles at the Hamburg University of Technology\, Politecnico di Milano\, and other European universities. His research focuses on high-voltage automotive systems\, EMC filter design\, magnetic field emissions\, and advanced inverter modulation techniques\, bridging industry practice with academic excellence. He continues to advance EMC knowledge\, guide future engineers\, and support the global adoption of reliable and safe electric mobility. \nDate: Wednesday\, October 7\, 2026 \nTime: 4:00pm – 5:30pm (EDT)
URL:https://www.emcs.org/event/emc-society-distinguished-lecturer-series-electric-vehicle-powertrain-challenges-for-emc-hv-emc-filter-for-compliance-of-electric-vehicles/
CATEGORIES:EMC SOCIETY DISTINGUISHED LECTURER WEBINAR
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/06/DL_Guido-Rasek_480x270.png.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261026
DTEND;VALUE=DATE:20261030
DTSTAMP:20260713T210734Z
CREATED:20260713T205959Z
LAST-MODIFIED:20260713T210734Z
UID:10000089-1792972800-1793318399@www.emcs.org
SUMMARY:IEEE RADIO 2026
DESCRIPTION:The 10th edition of the IEEE RADIO international conference will be held from 26th to 29th October 2026 in Cape Town\, South Africa. The aim of the conference is to discuss recent developments\, theories and practical applications covering the whole scope of radio frequency engineering\, including radio waves\, antennas\, propagation and electromagnetic compatibility. \nConference website: https://www.radiosociety.org/radio2026
URL:https://www.emcs.org/event/ieee-radio-2026/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/07/IEEE_RADIO_2026.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261104
DTEND;VALUE=DATE:20261107
DTSTAMP:20260713T212724Z
CREATED:20260713T212724Z
LAST-MODIFIED:20260713T212724Z
UID:10000091-1793750400-1794009599@www.emcs.org
SUMMARY:2026 International Workshop on Advanced Interconnects
DESCRIPTION:Hangzhou\, China \nConference website: http://wai-emc.com/wai2026
URL:https://www.emcs.org/event/2026-international-workshop-on-advanced-interconnects/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/07/WAI-2026.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20261104T160000
DTEND;TZID=America/New_York:20261104T173000
DTSTAMP:20260630T192143Z
CREATED:20260630T191812Z
LAST-MODIFIED:20260630T192143Z
UID:10000087-1793808000-1793813400@www.emcs.org
SUMMARY:EMC Society Distinguished Lecturer Series: Metrology Aspects of Reverberation Chambers
DESCRIPTION:Metrology Aspects of Reverberation Chambers \nSpeaker Bio:\nProf. Ramiro Serra\nAssociate Professor\, Eindhoven University of Technology (TU/e)\, in the Netherlands \nAbstract:\nThis presentation provides an introduction on how radiated EMC measurements can be performed in RCs. We discuss the basic principles behind such measurements\, particularly the concept of statistical field uniformity. The basic measurement techniques are described as well as some state-of-the-art measurement techniques employing advanced equipment. An in-depth discussion on measurement uncertainty is provided\, by describing the influence of multiple and concurrent field correlations in the quantification of the intrinsic field uncertainty\, a unique and key concept in RCs. It is possible to add to this presentation\, if desired\, some considerations on an ongoing discussion point in the EMC community: how to set up limits for acceptance levels in RCs. This point would not be a “lecture” strictly speaking\, but more like an open discussion and sharing of an opinion. (Note: We are running a large inter-laboratory comparison exercise. Results from that study will be available after October 2025; hopefully\, and\, if possible\, added to this presentation.) \nSpeaker Bio:\nRamiro Serra received the MSc degree in electronic engineering from the Instituto Tecnológico de Buenos Aires\, Argentina\, in 2000\, the postgraduate degree specializing in technological applications of nuclear energy from Instituto Balseiro\, Bariloche\, Argentina in 2004 and the PhD degree in electronics and communications engineering from Politecnico di Torino\, Italy in 2009. He is currently an associate professor within the Laboratory of EMC at the Eindhoven University of Technology (TU/e) in the Netherlands and the program director of the electrical engineering department at TU/e. Dr. Serra is a member and the vice-chair of the international steering committee of EMC Europe and a member of the international TPC of EMC Compo. He is the chairman of URSI Commission E for the Netherlands and secretary of URSI National Committee of the Netherlands. He is also co-convener of the SC 77B/CISPR-A joint working group for the standard IEC 61000-4-21 on reverberation chambers. \nDate: Wednesday\, November 4\, 2026 \nTime: 4:00pm – 5:30pm (EST)
URL:https://www.emcs.org/event/emc-society-distinguished-lecturer-series-metrology-aspects-of-reverberation-chambers/
CATEGORIES:EMC SOCIETY DISTINGUISHED LECTURER WEBINAR
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/06/DL_RamiroSerra_480x270.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20261116T090000
DTEND;TZID=America/New_York:20261117T170000
DTSTAMP:20260519T202642Z
CREATED:20260519T172041Z
LAST-MODIFIED:20260519T202642Z
UID:10000075-1794819600-1794934800@www.emcs.org
SUMMARY:Board of Governors’ Meeting - New Jersey
DESCRIPTION:Board meetings are open to those interested in the administration of the EMC Society. For information on the Board meetings\, contact Ashley Tuguga\, a.tufuga@ieee.org. \nYour involvement is welcome! \nNovember 16 – 17\, 2026 •  9:00 AM – 5:00 PM EST\nLocation: IEEE Headquarters –\n445 Hoes Lane\, Piscataway\, New Jersey
URL:https://www.emcs.org/event/board-of-governors-meeting-new-jersey-2/
LOCATION:IEEE Headquarters\, 445 Hoes Lane\, Piscataway\, NJ\, NJ\, 08854\, United States
CATEGORIES:EMC BoG AND STANDARDS MEETINGS,IN-PERSON
ATTACH;FMTTYPE=image/png:https://www.emcs.org/wp-content/uploads/2026/05/BoardGovernorsMeeting_480x270.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20270412
DTEND;VALUE=DATE:20270415
DTSTAMP:20260713T211829Z
CREATED:20260713T204533Z
LAST-MODIFIED:20260713T211829Z
UID:10000088-1807488000-1807747199@www.emcs.org
SUMMARY:EMC Hungary2027
DESCRIPTION:The 2nd EMC Hungary Conference will take place in Kecskemét\, Hungary\, from 12–14 April 2027. \nEMC Hungary 2027 – EMCH2027\, International Conference on Electromagnetic Compatibility is the second occasion of the biennial EMCH conference series on Electromagnetic Compatibility organized jointly by the University of Miskolc\, Rohde & Schwarz Hungária Kft. and thyssenkrupp Components Technology Hungary Kft. \nLearn More at: https://2027.emc-hungary.hu
URL:https://www.emcs.org/event/emc-hungary2027/
LOCATION:Four Points by Sheraton Kecskemet Hotel & Conference Center\, Izsáki út 6.\, Kecskemét\, 6000\, Hungary
CATEGORIES:EMC SOCIETY ENDORSED CONFERENCES
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/07/EMCH_logo.jpg
GEO:46.8979729495;19.673495648
X-APPLE-STRUCTURED-LOCATION;VALUE=URI;X-ADDRESS=Four Points by Sheraton Kecskemet Hotel & Conference Center Izsáki út 6. Kecskemét 6000 Hungary;X-APPLE-RADIUS=500;X-TITLE=Izsáki út 6.:geo:19.673495648,46.8979729495
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20270517
DTEND;VALUE=DATE:20270521
DTSTAMP:20260713T211650Z
CREATED:20260713T211650Z
LAST-MODIFIED:20260713T211650Z
UID:10000090-1810512000-1810857599@www.emcs.org
SUMMARY:APEMC 2027
DESCRIPTION:The 2027 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC 2027) will be held at the Grand Hyatt Jeju in Jeju Island\, Republic of Korea\, from May 17 to 20\, 2027. The symposium aims to share recent advances in all aspects of EMC in the Asia-Pacific region\, to respond to the EMC requirements for all rising technologies\, and to link up the international EMC community closely. We warmly invite all prospective authors and experts to submit original papers on their latest research findings and outcomes. We also welcome proposals for focused sessions\, industrial forums\, workshops\, and tutorials. \nConference website: https://apemc2027.org
URL:https://www.emcs.org/event/apemc-2027/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA
ATTACH;FMTTYPE=image/jpeg:https://www.emcs.org/wp-content/uploads/2026/07/APEMC2027.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20270712T080000
DTEND;TZID=America/New_York:20270716T170000
DTSTAMP:20260713T205252Z
CREATED:20251027T210645Z
LAST-MODIFIED:20260713T205252Z
UID:10000039-1815379200-1815757200@www.emcs.org
SUMMARY:2027 Annual IEEE International Symposium on EMC+SIPI
DESCRIPTION:Portland\, OR \nConference website: https://2027.emcsipi.org
URL:https://www.emcs.org/event/2027-annual-ieee-international-conference-on-emcsipi/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA,IEEE EMC+SIPI ANNUAL SYMPOSIA
ATTACH;FMTTYPE=image/png:https://www.emcs.org/wp-content/uploads/2025/10/2027EMCSIPI_480x270_V2.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20270823T080000
DTEND;TZID=America/New_York:20270827T170000
DTSTAMP:20260408T003825Z
CREATED:20260217T194938Z
LAST-MODIFIED:20260408T003825Z
UID:10000060-1819008000-1819386000@www.emcs.org
SUMMARY:2027 Joint EMC Europe & International Symposium on Electromagnetic Compatibility\, Signal & Power Integrity
DESCRIPTION:Discover the Legacy and Beauty of Scotland \nJoin us in Glasgow\, the historic gateway to Silicon Glen. This innovative region has transformed into a beacon\nof technology leadership\, renowned for its specialized electronics and cutting-edge research. \nEngage with industry leaders and experts\, and immerse yourself in the wealth of knowledge they offer in this unique joint international conference. \nExtend your journey beyond the city and explore Scotland’s stunning Highlands\, historic castles\, and pristine lochs. Experience the perfect balance of technical heritage and the magical allure of Scotland.
URL:https://www.emcs.org/event/2027-joint-emc-europe-international-symposium-on-electromagnetic-compatibility-signal-power-integrity/
LOCATION:Glasgow\, Scotland\, Glasgow\, United Kingdom
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA,IEEE EMC+SIPI ANNUAL SYMPOSIA
ATTACH;FMTTYPE=image/png:https://www.emcs.org/wp-content/uploads/2026/02/Glasgow2027.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20280731T080000
DTEND;TZID=America/New_York:20280804T170000
DTSTAMP:20260629T173844Z
CREATED:20251027T210743Z
LAST-MODIFIED:20260629T173844Z
UID:10000040-1848643200-1849021200@www.emcs.org
SUMMARY:2028 Annual IEEE International Symposium on EMC+SIPI
DESCRIPTION:Milwaukee\, WI
URL:https://www.emcs.org/event/2028-annual-ieee-international-conference-on-emcsipi/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA,IEEE EMC+SIPI ANNUAL SYMPOSIA
ATTACH;FMTTYPE=image/png:https://www.emcs.org/wp-content/uploads/2025/10/2028EMCSIPI_480x270-1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20290722T080000
DTEND;TZID=America/New_York:20290728T170000
DTSTAMP:20260629T173808Z
CREATED:20251027T210842Z
LAST-MODIFIED:20260629T173808Z
UID:10000041-1879401600-1879952400@www.emcs.org
SUMMARY:2029 Annual IEEE International Symposium on EMC+SIPI
DESCRIPTION:Providence\, Rhode Island
URL:https://www.emcs.org/event/2029-annual-ieee-international-conference-on-emcsipi/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA,IEEE EMC+SIPI ANNUAL SYMPOSIA
ATTACH;FMTTYPE=image/png:https://www.emcs.org/wp-content/uploads/2025/10/2029EMCSIPI_480x270-1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/New_York:20300721T080000
DTEND;TZID=America/New_York:20300726T170000
DTSTAMP:20260630T182013Z
CREATED:20260629T175217Z
LAST-MODIFIED:20260630T182013Z
UID:10000078-1910851200-1911315600@www.emcs.org
SUMMARY:2030 Annual IEEE International Symposium on EMC+SIPI
DESCRIPTION:Calgary\, Canada \n 
URL:https://www.emcs.org/event/2030-annual-ieee-international-symposium-on-emcsipi/
CATEGORIES:EMC RELATED CONFERENCES AND SYMPOSIA,IEEE EMC+SIPI ANNUAL SYMPOSIA
ATTACH;FMTTYPE=image/png:https://www.emcs.org/wp-content/uploads/2026/06/2030EMCSIPI_480x270.png
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