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The IEEE EMC Society
Distinguished Lecturer Program

The Distinguished Lecturer Programis pleased to introduce a new program - the Respected Speaker Bureau. Click here for more information

The EMC Society's Distinguished Lecturer Program (DLP) provides speakers on various aspects of electromagnetic compatibility for EMC Society chapter meetings and similar functions. While presentations to groups outside of the EMC Society and the IEEE are encouraged, the program is not intended for national or international EMC symposiums, regional conventions, local colloquiums, trade shows, or commercial seminars. Speaking engagement arrangements are made by the benefiting organization directly with the Distinguished Lecturer. Scheduling and minimum audience size are at the discretion of the Lecturer.

Distinguished Lecturer Engagements are Subsidized

Each Distinguished Lecturer may present six subsidized or shared expense talks each year. The EMC Society will reimburse Distinguished Lecturer's travel expenses for approved speaking engagements up to a recommended limit of $1000 per engagement, but this is subject to negotiation and program budget constraints. (When travel expenses for any single trip will exceed this amount, the Lecturer must obtain prior approval before making travel arrangements.)

The EMC Society will reimburse current Distinguished Lecturers up to $1,250 for presentations to EMC Chapters located outside the DL's home continent. Since budget constraints permit few of these trips per year, each trip must be approved in advance by the Distinguished Lecturer Program chairman and the Society's Director of Member Services. (Re: EMCS BOD, 5 May 1997).

The VP for Member Services may approve an increased funding for Intra-Region, international DL travel (or in other special cases, not covered by the current DL Travel Policy), not to exceed a total of US$1,500 per engagement. Requests for increased funding shall be provided by the DL including due justification and the recommendation of the DL committee chair. Requests for increased funding must be submitted at least 30 days prior to the said engagement. The approval of the VP for Member Services must be obtained prior to finalizing lecture arrangements. The VP for Member Services shall report to the BoD in any such case no later than the following BoD meeting (Re: EMCS BOD, 17 August 2006) .

Sharing of expenses between the benefiting organization and the EMC Society is encouraged. For example, the benefiting organization could provide local transportation for the Lecturer, provide meals, etc. Benefiting organizations will please give credit to the "Electromagnetic Compatibility Society, Institute of Electrical and Electronics Engineers" in their newsletter or other announcements.

Scheduling a Distinguished Lecturer

1.      Review lecturer list below, then contact lecturer directly to arrange for the engagement:

•  Date, time, and location of the engagement
•  Name and affiliation of benefiting organization
•  Estimated audience size and type (engineers? students?)
•  Topic lecturer will present
•  Discuss what logistical needs can be provided by the benefiting organization (e.g., ground
transportation, meals, handout copying, video display projector, other shared expenses, etc.)
•  Principal benefiting organization contact.

2.      Include summary of talk to be presented and lecturer's bio in the benefiting organization's newsletter or meeting announcement.

Selection of Distinguished Lecturers

The program consists of at least four Distinguished Lecturers, selected by the Program Chairman from written nominations or application from EMC Society members, and approved by the EMC Society Board of Directors. The term for each Distinguished Lecturer is two years. Currently all terms start and end at the turn of a calendar year. Selection is based on (1) professional competence and recognition of EMC expertise, (2) communication and presentation skills, (3) EMC topics, (4) contribution to a balanced program, and (5) recommendation of EMC Society members. Membership in the EMC Society's Distinguished Lecturer program shall not be used in the advertising of products or [consulting] services, nor for any non-approved presentations such as product or training seminars or trade shows. Distinguished Lecturers may not, as part of any DLP presentation, advertise, market, or offer for sale, any commercial product or service.

Distinguished Lecturers

Prof. Giulio Antonini - Dr. Ji Chen - Dr. Joungho Kim - Dr. Omar M. Ramahi - Dr. Sergiu Radu - Mark Steffka

Prof. Giulio Antonini Dipartimento di Ingegneria Elettrica e dell'Informazione Universit degli Studi di L'Aquila I-67040, Monteluco di Roio, L'Aquila, ITALY tel. +39 0862 434462 fax +39 0862 434403 e-mail: antonini@ing.univaq.it Term: 2010-2011

• Interconnect time-domain modeling
  The rapid increase in operating speed and density of modern integrated circuits has made a challenging problem of transmission line modeling . Its difficulty resides in the requirement to properly capture physical effects like reflection, dispersion, delay, and attenuation, which cannot be neglected when broadband signals propagate along the interconnect. In addition, the presence of non-linear drivers and receivers call for efficient time-domain models. This lecture aims to present an overview of the state-of-art in interconnect modeling with a special attention to rational macromodels, state-space realization, model order reduction, parametric macromodels.


• The Partial Element Equivalent Circuit Method
  SI and EMC engineers often prefers to work with electrical equivalent circuits rather than electric and magnetic fields. The geometrical complexity of nowadays electronic systems and the broadband frequency of interest make necessary to adopt numerical methods to solve Maxwell's equations. Among the integral-equation based methods the Partial Element Equivalent Circuit (PEEC) method has gained an increasing popularity among SI and EMC engineers due to its capability to provide a circuit interpretation of the electric field integral equation (EFIE), thus allowing to handle complex problems involving EM fields and circuits. Since from its introduction, the PEEC method has evolved and new models have been added over the years, including dielectrics, lossy and dispersive dielectrics , magnetic materials. The aim of this lecture is to give a short introduction to the Partial Element Equivalent Circuit (PEEC) method and presents some of the most recent advancements which make the PEEC approach well suited to be used for analyzing many different EMC problems including crosstalk, antennas, lightning, skin-effect modeling, power electronics, signal integrity.


• Sensitivity analysis in Signal Integrity applications
  The recent advances in fabrication methods and the rapid increase in operating speeds, density, and complexity of modern integrated circuits has made signal integrity a challenging task for high-frequency circuit designers. Consequently, high-speed interconnects modeling has become crucial to properly capture physical effects such as reflection, crosstalk, propagation delays. The increased circuit density requires that designers make the proper trade-offs between conflicting design requirements using optimization techniques, to obtain the best possible performance. To this aim, efficient and accurate sensitivity information with respect to interconnect parameters are required by optimizers which employ powerful gradient based techniques and need the knowledge of sensitivities of the output responses. The lecture aims to present sensitivity analysis technique in both frequency and time-domain with respect to either geometric or physical parameters.

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Dr. Omar M. Ramahi, FIEEE Professor Electrical and Computer Engineering Department University of Waterloo, Waterloo, Canada 519-888-4567 x 37460 oramahi@ece.uwaterloo.ca Term: 2010-2011

• Electromagnetic Band Gap Structures for Noise Mitigation in Printed Circuit Boards and Packages
  This talk explores how electromagnetic band gap (EBG) structures, which are essentially exotic types of filters, enabled the design of power distribution networks that keep interference due to switching circuits to a minimum. The use of EBG for reducing board and package emissions will be explored as well. Succinct exposition of the EBG theory will be discussed without elaborate mathematical analysis.


• The exotic world of metamaterials and its relevance to EMI/EMC engineers
  Metamaterials refers to engineered material with properties that do not exist in naturally available media. Exotic properties of metamaterials includes negative index of refraction, negative permittivity, negative permeability or even negative permittivity and negative permeability simultaneously. Such metamaterial created so much excitements over the past few years, but can there be any practical application for EMI/EMC engineers? Can metamaterial provide solutions to some of the severe challenges in the areas of shielding and filtering? We will explore these questions and show that the field of EMI/EMC can benefit significantly from the development of metamaterials in the general area of shielding and filtering.


• Computational Electromagnetics and Electromagnetic Modeling: A Virtual Laboratory for EMC engineers or an academic exercise!
  While laboratory measurements remain the real proof that a certain product meets or violates certain EMI/EMC standards, computational electromagnetic and modeling remain an indispensable tool in the design process. In this talk, we explore advances in the field of computational electromagnetic and modeling. We show that computational electromagnetics can enhance our understanding of what is essentially the most fundamental radiating source within a structure. In fact, computational electromagnetic continues to be an excellent virtual laboratory for the designer who wants to explore the "what if" question before embarking on costly designs that may or may not work.


• What causes radiation?
  The field of EMI/EMC shares its heritage with antenna and propagation engineers, on the one hand, and physicists on the other. For the later group, much of the 20th century was spent on developing ways to predict the radiation due to some source or sources. Physicists, on the other hand, are interested in making the connection between the movement of the elementary charged particle, the electron, and the radiated field. EMI/EMC engineers are interested in the work of these two groups, but would also like to know, which sources/currents are the ones that cause radiation! Is such dichotomy a mere academic or philosophical exercise or does it have relevance to practical engineering practice. In this talk we explore the fundamental question of "what causes radiation" from a purely practical and engineering-relevant perspective.

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Mark Steffka EMC Technical Specialist - GM Powertrain Mail Code: 483-340-111 3300 General Motors Road Milford, Michigan 48380-3726 Email: mark.a.steffka@gm.com Phone: (248) 255-7441 Term: 2010-2011

• Automotive EMC
  This topic covers EMC approaches applied to automotive systems, from the conventional "legacy" systems to the latest developments in electric vehicle propulsion. There is discussion about the unique environment that automotive systems function in and how some of the methods used to meet automotive system functional requirements can determine the vehicle's EMC characteristics. Typical automotive EMC requirements are identified and examined, along with "case studies".


• Conducted Emissions, Power Supplies, and LISNs.
  With the proliferation of digital methods from data communication to machine and equipment control, as well as the increasing use of switched mode power supplies (SMPS), conducted emissions are becoming more of a concern. This topic discusses the physics involved in conducted emissions, how to measure those emissions, the trade-offs in power supply issues versus EMC, and effective filtering methods. Diagnostic methods to identify the nature and source of conducted emissions are presented as well as corrective actions to solve those problems are identified.


• Antennas and Transmission lines.
  The effective and efficient use of radio frequency communication is solely dependent upon transferring electromagnetic energy to and from an antenna. This energy transfer is also responsible for EMC issues. Many engineers today working in EMC (as well as those working in electronic system design/development) either have not had a formal background in antennas and transmission lines, or have not had an opportunity to practice their previous knowledge or skills in this area. Since these components can "make or break" a product's EMC compliance, or render a system non-functional - it is critical that there be an understanding of the issues involved. The topic material consists of a review of antenna and transmission line theory, use of the relevant basic mathematics, overview of computer methods to assist in antenna design, and "real-life" examples.


• Process and Benefits of Industry / Academic Linkage in EMC Education
  One of the unique aspects of EMC is that it is the integration of academic-based theory as applied to the "real world". This creates a challenge for the ability of either academia or industry on their own to adequately "teach EMC". The typical result is that in academic setting, either the theory is emphasized, with little linkage to applications, or in an industry setting only the applications are studied and those become a "cookbook" approach for all EMC issues. Bridging the gap between the knowledge in academia and the applications in industry is critical to any successful EMC work. This topic examines the methods than need to be considered when trying to fill in this gap and highlights examples of successes of that work.

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Dr. Joungho Kim Professor Director of Convergence Device and System Group Department of Electrical & Computer Engineering KAIST (Korea Advanced Institute of Science and Technology) Daejon, Korea Phone: 82-42-869-3458 Email: joungho@ee.kaist.ac.kr Term : 2009-2010

• EMC design of IC and package
  We are facing considerably increased concerns on EMC issues of high performance integrated circuits, and automotive semiconductor devices. They emit significant amount of high frequency electromagnetic radiated and conducted emissions and are susceptible to external electromagnetic noises, suffering degradation of system performance and reliability. In this talk, novel design and analysis methodologies will be introduced to provide optimal design approaches by combining IC and package hierarchical designs of equalizer and PDN impedance. In addition, measurement results of IC and package co-design will be shown including RF circuits such as LNA and PA, and analog circuits such as PLL, DLL, OpAmp, and ADC.
  

Outline:
1. Background: Increased concern at high performance IC and automotive semiconductors.
2. Electromagnetic emission and susceptibility issues of IC and package
3. IC and package co-design and analysis of EMC: hybrid equalizer and low impedance PDN
4. Electromagnetic susceptibility study on RF circuits: LNA, PA
5. Electromagnetic susceptibility study of analog circuits: OpAmp, DLL, PLL, and ADC
6. EMC design issues of 3D IC based on TSV
7. Conclusion

• Low Electromagnetic Noise Design of System-In-Package

In order to meet intensively growing needs of extremely small form-factor semiconductor system solutions with sufficiently low cost for high-density and multi-function mobile platforms, 3D SiP has become the most promising design approach. However, heavily populated integration of multiples chips in three dimensional stacking structures on a multi-layer substrate in the SiP, inevitably yields considerable problems of signal integrity and power integrity. In this talk, design and analysis approaches will be introduced with the considerations of the signal integrity, power integrity, and electromagnetic coupling at the high speed and low noise 3D SiP's. In addition, we will introduce design and text examples including RFID, DMB, ZigBee, and UWB SiP's.

Outline:
1. Introduction
2. EMC issues in high-density SiP design
3. Signal and power integrity issues in SiP design
4. Hybrid equalization designs and measurements
5. Novel 3D clock distribution networks for SiP
6. Chip-package noise couplings and suppressions in SiP
7. Design and measurement of RFID, DMB, ZigBee, and UWB SiP's.
8. Low Noise 3D IC design
9. Conclusions.

• Power Integrity of IC and Package

Power supply noise by digital switching is becoming the major source of electromagnetic noise generation and coupling in semiconductor systems. It could be even more serious in 3D SiP and IC based on vertical TSV type interconnections for high-density and multi-function mobile multimedia, computing, and communication system platforms. In this talk, new modeling, design, and analysis approaches will be introduced with the consideration of the power integrity. The unique methods are based on simultaneous and hierarchical chip-package co-design and modeling in order to offer cost effective design solutions. In particular, we will shown novel design methods and test results including thin film capacitor and EBG structures to minimize the power supply noise generation and coupling. Outline:
1. Introduction
2. Power integrity of IC
3. Power integrity of package
4. Modeling and analysis of hierarchical PDN
5. Hierarchical decoupling and high dielectric thin film design
6. Noise generation and coupling by via and PDN's
7. EBG structure and suppression of SSN
8. PDN effects on RF and analog circuits.
9. PDN design issues in 3D IC based on TSV
10. Conclusions.

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Dr. Ji Chen Associate Professor Department of Electrical & Computer Engineering University of Houston Houston, TX 77204 713-743-4423 Email: ji.chen@mail.uh.edu Term 2009-2010

• EMC/EMI issues in biomedical engineering: This topic will discuss the interactions between electromagnetic devices and biomedical system. In particular, we will discuss the electromagnetic devices such as walk-through metal detectors and MRI RF coil in human subjects and implanted devices.
• EMC/EMI in wireless communications: The SAR and board-level electromagnetic modeling will be discussed in this talk.
• Developing nano-scale structures for EMC/EMI: In this talk, we will discuss the modeling and development of micro-leveled periodic structures for EMC applications.

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Dr. Sergiu Radu Principal Engineer,NCE Sun Microsystems, Inc. Electromagnetic Compatibility Design 220 Jefferson Drive, MS UMPK25-102 Menlo Park, CA 94025 - 1164 Phone: (650) 786 - 3465 E-mail: sergiu.radu@sun.com Term 2009-2010

• Engineering Aspects of Electromagnetic Shielding

  Every electronic equipment use some type of shielding, and from a theoretical point of view,  electromagnetic shielding is among the difficult areas of EMC. The lecture is introducing basic shielding concepts, insisting on their practical limitations, and presents the typical engineering problems associated with shielding. Among the aspects discussed are the materials used for shielding, chassis resonances, shielding integrity problems (seams, joints, apertures, perf patterns), aperture coupling and shield's grounding.

  Outline:
  1. Introduction: Electric, Magnetic and Electromagnetic shielding
  2. Basics approaches to shielding: field theory (Kaden) and circuit theory (Schelkunoff)
  3. Limits of the theoretical approaches: numerical simulations
  4. Practical aspects of shielding, typical requirements, grounding scheme
  5. Shield material: metal, plastic, typical coatings
  6. Shield construction: rivets, joints, seams, apertures
  7. Shielding and thermal issues: holes, perf patterns, honeycomb
  8. Shield integrity and gaskets
  9. Internal compartmentalization of a chassis, resonances
  10. Practical aspects of source - aperture coupling
  11. Shielding for radiated emissions, radiated immunity and ESD - reciprocity aspects and limits
  12. Evaluation of shielding effectiveness

• An Overview of Chip Level EMC Problems

  The CPUs and the VLSI chips are the primary sources of electromagnetic noise in all electronic equipments. Reducing the electromagnetic noise at source level is usually the best and the most economical solution. The lecture presents typical interference mechanisms associated with CPU/VLSI, as well as mitigation methods at die-level and package level. Among the aspects discussed are some power distribution issues, on-die decoupling, package capacitors, routing aspects, the impact of back-bias and forward-bias, and the impact of die-shrinks on the EMI performance of the VLSI chips.

  Outline:
  1. Introduction: typical CPU radiation
  2. EMI mechanisms for VLSI chips
  3. Heatsink effect for large chips
  4. Power distribution effects for large chips
  5. Package level design for EMI and SI
  6. Package stack-up and layer allocation
  7. Package capacitors and their effect, package resonances
  8. Routing and pin allocation aspects
  9. Die level - general aspects
  10. On-die decoupling
  11. Back-bias impact on EMI
  12. Die-shrink impact on EMI

• Engineering Aspects of PCB Level EMC Design

  The PCB design is a complex cooperation between electrical, mechanical, thermal, SI,
  PI and EMC design. In a practical design, the EMC design engineer has to make trade-offs and understand the relative impact of different design choices. The lecture is an overview of the typical PCB design aspects and their role for the EMC performance. Among the aspects discussed are placement, stack-up, routing, decoupling, and grounding aspects. The design of the I/O ports , in order to pass the emissions and immunity tests is also discussed in greater detail.

  Outline:
  1. Introduction - what matters for EMI
  2. Stack-up principles and practical examples
  3. Placement - potential EMI impact
  4. Routing aspects which may impact EMI
  5. Decoupling: power engineering, SI and EMI approaches.
  6. Grounding scheme and exceptions, heatsink grounding
  7. Stitching
  8. Spread spectrum use and limits
  9. Ethernet port
  10. USB port
  11. Serial port
  12. Serial buses (PCIe, SAS/SATA, IB) and EMI impact

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For more information, contact the program chairman:
Bruce Archambeault, Ph.D.
IBM Distinguished Engineer, IEEE Fellow
EMC CoC
919-486-0120
t/l 526-0120
IBM
B306, E114
3039 Cornwallis Rd
Dept 18DA
RTP, NC 27709
barch@us.ibm.com

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