The IEEE EMC Society
Distinguished Lecturer Program

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Announcing the new Video Distinguished Lecturer Program!
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The EMC Society's Distinguished Lecturer Program (DLP) provides speakers on various aspects of electromagnetic compatibility for EMC Society chapter meetings and similar functions. While presentations to groups outside of the EMC Society and the IEEE are encouraged, the program is not intended for national or international EMC symposiums, regional conventions, local colloquiums, trade shows, or commercial seminars. Speaking engagement arrangements are made by the benefiting organization directly with the Distinguished Lecturer. Scheduling and minimum audience size are at the discretion of the Lecturer.

Distinguished Lecturer Engagements are Subsidized

Each Distinguished Lecturer may present six subsidized or shared expense talks each year. The EMC Society will reimburse Distinguished Lecturer's travel expenses for approved speaking engagements up to a recommended limit of $1000 $1,500 per engagement, but this is subject to negotiation and program budget constraints. (When travel expenses for any single trip will exceed this amount, the Lecturer must obtain prior approval before making travel arrangements.)

The EMC Society will reimburse current Distinguished Lecturers up to $1,250 $2,000 for presentations to EMC Chapters located outside the DL's home continent. Since budget constraints permit few of these trips per year, each trip must be approved in advance by the Distinguished Lecturer Program chairman and the Society's Director of Member Services. (Re: EMCS BOD, 5 May 1997).

The VP for Member Services may approve an increased funding for Intra-Region, international DL travel (or in other special cases, not covered by the current DL Travel Policy), not to exceed a total of US$1,500 $2,000 per engagement. Requests for increased funding shall be provided by the DL including due justification and the recommendation of the DL committee chair. Requests for increased funding must be submitted at least 30 days prior to the said engagement. The approval of the VP for Member Services must be obtained prior to finalizing lecture arrangements. The VP for Member Services shall report to the BoD in any such case no later than the following BoD meeting (Re: EMCS BOD, 17 August 2006) .

Sharing of expenses between the benefiting organization and the EMC Society is encouraged. For example, the benefiting organization could provide local transportation for the Lecturer, provide meals, etc. Benefiting organizations will please give credit to the "Electromagnetic Compatibility Society, Institute of Electrical and Electronics Engineers" in their newsletter or other announcements.

Scheduling a Distinguished Lecturer

1.      Review lecturer list below, then contact lecturer directly to arrange for the engagement:

•  Date, time, and location of the engagement
•  Name and affiliation of benefiting organization
•  Estimated audience size and type (engineers? students?)
•  Topic lecturer will present
•  Discuss what logistical needs can be provided by the benefiting organization (e.g., ground
transportation, meals, handout copying, video display projector, other shared expenses, etc.)
•  Principal benefiting organization contact.

2.      Include summary of talk to be presented and lecturer's bio in the benefiting organization's newsletter or meeting announcement.

Selection of Distinguished Lecturers

The program consists of at least four Distinguished Lecturers, selected by the Program Chairman from written nominations or application from EMC Society members, and approved by the EMC Society Board of Directors. The term for each Distinguished Lecturer is two years. Currently all terms start and end at the turn of a calendar year. Selection is based on (1) professional competence and recognition of EMC expertise, (2) communication and presentation skills, (3) EMC topics, (4) contribution to a balanced program, and (5) recommendation of EMC Society members. Membership in the EMC Society's Distinguished Lecturer program shall not be used in the advertising of products or [consulting] services, nor for any non-approved presentations such as product or training seminars or trade shows. Distinguished Lecturers may not, as part of any DLP presentation, advertise, market, or offer for sale, any commercial product or service.

Distinguished Lecturers

Charles Bunting - Jerry Meyerhoff - Professor Wen-Yan - Prof. Dr. Christian Schuster - Sam Connor - Madhavan Swaminathan - Jong-Gwan Yook

Charles F. Bunting                                                                ECE Department, ES 202                                                     Oklahoma State University Stillwater, OK 74078 reverb@okstate.edu PHONE: (405) 744-1584 Term: 2011-2012

1. Overview of numerical methods for electromagnetic compatibility
This talk provides an overview to many of the commonly used numerical EMC modeling techniques.  It is intended to provide EMC engineers who are interested in learning the basics of these modeling techniques a fundamental understanding of all the different techniques, with plenty of applications to EMC problems.

2. Why use reverberation chambers for radiated emissions?
Unlike a semi-anechoic chamber a reverberation chamber provides a test electromagnetic environment, as a superposition of plane waves with random phase, resulting from repeated reflections from conducting surfaces intentional formed to create a complex environment. The statistical isotropy, random polarization, and uniform electromagnetic environment of a reverberation chamber permit a robust, all aspect angle test without the requirement for rotation or translation of the equipment-under-test.  This talk will discuss the potential benefits of EMC testing in a reverberation chamber.

3. Reverberation chamber theory/statistical overview
To understand the application of reverberation chambers EMC engineers must delve into the scary world of statistics and applied random variables.  This talk provides a discussion of the statistical electromagnetic environment in a reverberation chamber and the method by which the equipment under test can be tested to a given peak (or average) component (or total) field (or power) level with a definable uncertainty.

Professor Wen-Yan Center for Optical and Electromagnetic Research, Zhejiang University, Hangzhou 310058, China Center for Microwave and RF Technologies, Shanghai Jiao Tong University, Shanghai 200240, China (+86)-571-88206526 (Office), Hangzhou, China (+86) -21-34204339 (Office), Shanghai, China wyyin@zju.edu.cn and wyyin@sjtu.edu.cn Term: 2011-2012

1. Mutiphysics Method for High-Power Electromagnetics We are now facing considerably concerns on intentional and non-intentional electromagnetic interferences (IEMI & EMI) issues related to various communication platforms, which can cause serious degradation in reliability of devices, circuits and systems. In this talk, multiphysics-based time–domain finite element method will be introduced and implemented for fast capturing transient electro-thermo-mechanical responses of various on-chip interconnects, devices and circuits under the impact of an (I)EMI signal, such as double-exponential high-power EMP and electrostatic discharge(ESD), etc.

 

2. Multiphysics Solution for Nanoelectronics
More recently, significant progress has been achieved in the development of carbon nanotube (CNT)-based interconnects and CNT field effect transistors (CNTFET). In order to thoroughly understand signal transmission characteristics of single-, double-, and multi-walled carbon nanotube (SWCNT & DWCNT& MWCNT) transmission lines & cables, we have to take quantum effects into account appropriately. In this talk, multiphysics solutions to various SWCNT, DWCNT, and MWCNT transmission lines and active devices will be addressed, with both frequency- and temperature- dependent quantum effects treated in detail.

 

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Jerry Meyerhoff   JDM LABS LLC jerrymeyerhoff@ieee.org      847-630-2769 Term: 2011-2012

1.      What's the resonant frequency of a Truck?
When an automotive electronic control module shows narrowband susceptibility,  what is the cause and what can be done about it ? The truck cab structure is analyzed using NEC-MoM on a simplified wireframe model.

2. Issues in CISPR 25 Radiated Emissions Setups
Why do many different electronic control modules show excessive emissions in the same repeatable bands of frequencies in a given CISPR 25 setup ?  The problem is analyzed in a modern 3D CAE Electromagnetic Solver.  Model simplification and fitting to the tool's methodology is discussed. Correlation to measured data is presented.

3. Why does my module fail EMC ?
Case studies drawn from multiple designs are used to demonstrate the
underlying EMC physics for causes and cures. Solutions are generalized
for applicability to multiple future designs.

 

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1. Fundamentals of Signal Integrity and Power Integrity
This presentation gives an introduction to the fundamentals of signal and power integrity engineering for high-speed digital systems with a focus on packaging aspects. It is intended for an audience that has little or no formal training in electromagnetic theory and microwave engineering. Topics that will be addressed include lumped discontinuities, transmission line effects, crosstalk, bypassing and decoupling, power plane effects, return current issues, and measurement techniques.

2. Physics and Modelling of Vias in Printed Circuit Boards
This presentation gives an overview of the current understanding and simulation of electromagnetic fields around vias in printed circuit boards with a focus on the so called physics based via model. It is intended for an audience that has a basic knowledge of electromagnetic theory and network theory. Topics that will be addressed include the physics of parallel plane modes and their impact on via behavior, equivalent circuit models for signal vias, effect of ground vias, and the impact of floating planes on signal transmission.

3. Using the Contour Integral Method for EMC Problems
This presentation summarizes recent advances in the application of the so called contour integral method to EMC problems with a focus on the modelling of wave propagation in parallel plane structures. It is intended for an audience that has some knowledge of electromagnetic theory and its numerical methods. Topics that will be addressed include a review of the basic formulation of the contour integral method, the application to via coupling within parallel planes, the combination with the so called physics based via model, and the hybridization with the method of moments for computation of radiation effects. 

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1. Automated EMC Design Rule Checking: Past, Present, and Future
The complexity of circuit boards and systems has risen dramatically over the last couple decades, along with the data rates of the signals being used. At the same time, development cycles have compressed, and teams have been divided across time zones and continents. In the past, manual reviews of circuit boards and system wiring were possible in the time available, and EMC engineers could share design guidelines with board designers down the hall. Nowadays, design guidelines must be accessible worldwide, instantaneously, and they need to be checked in a repeatable manner to ensure quality. As technology changes, new rules must be developed quickly based on lessons learned and simulation results. These demands have driven the need for automated, customizable rule checking applications. Up until now, these applications have focused on electrical designs, as this is typically viewed as the source of EMC problems. Looking ahead, though, this methodology needs to be applied to all aspects of a system design if it is going to identify the system-level integration issues that often derail products during certification testing.

2. Differential Signaling Is the Opiate of the Masses
A large concern with the proliferation of differential signaling is the false sense of
security that comes along with its usage. Differential signals are hailed for their immunity to noise coupling and for their propagation characteristics. Differential receivers have great common mode rejection, and with equalization, receivers can pull meaningful signals out of a closed eye diagram. But with all of these benefits, the often forgotten drawback is that differential signals on PCBs are not truly differential and they do not perfectly cancel. The various asymmetries in the routing of the differential pair and the impedance discontinuities of vias and connectors and the imbalance and skew of the drivers all create a common mode signal on the differential pair that can cause serious EMC problems when coupled to other nets or radiated from cables and connectors.

3. Effective Use of Full-wave Models to Evaluate Design Tradeoffs
The demands of schedule and cost for most electronic products do not allow for multiple design iterations, so EMC engineers can no longer wait for hardware to be built and measured in the EMC lab before making design change recommendations. EMC engineers can participate sooner in the product development process if they are comfortable with the full-wave modeling tools available today and if they understand the tools’ limitations. This presentation discusses various modeling approaches and gives many practical examples of how simulations can help one understand the impact of specific design features on the overall EMC performance of a system. It will also show how the results can add credibility to their design change

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1. Designing for Power Integrity: Status, Challenges and Opportunities
Since the mid-1990s, designers have been developing sophisticated methods for managing power integrity in packages and printed circuit boards which has had a direct impact on the signal integrity of systems. These have included items such as developing design parameters such as target impedance, developing repeatable frequency domain characterization methods, pushing the EDA vendors to improve the capability of the design tools, developing new devices such as EBGs to improve isolation, developing embedded capacitance layers to name a few. However, the designers are continuing to face challenges where the noise on the power distribution is beginning to over shadow the signals in fast switching environments arising in high speed computing systems. These challenges are often times opportunities for university research that can lead to interesting and often times innovative solutions.  This talk will cover a review of the past developments in this area and will focus on the present challenges and potential solutions in the area of power delivery.

2. Multi-scale and Multi-physics modeling: Their role in 3D Integration
Over the last several years, the buzzword in the electronics industry has been “More than Moore”, referring to the embedding of components into the package substrate and stacking of ICs and packages using wirebond and package on package (POP) technologies. This has led to the development of technologies that can lead to the ultra-miniaturization of electronic systems with coining of terms such as SIP (System in Package) and SOP (System on Package). More recently, the semiconductor industry has started focusing more on 3D integration using Through Silicon Vias (TSV). This is being quoted as a revolution in the electronics industry by several leading technologists. 3D technology, an alternative solution to the scaling problems being faced by the semiconductor industry provides a 3rd dimension for connecting transistors, ICs and packages together with short interconnections, with the possibility for miniaturization, as never before. The semiconductor industry is investing heavily on TSVs as it provides opportunities for improved performance, bandwidth, lower power, reduced delay, lower cost and overall system miniaturization. A major bottleneck today for 3D system implementation is in the Electronic Design Automation (EDA) area.  In this talk, challenges in the design of 3D ICs and packages with a focus on design automation relating to multi-scale and multi-physics effects will be presented.

3.  Micro and Nano miniaturization of systems
The main driver for the semiconductor industry has been Moore’s law where the doubling of transistors has led to phenomenal increase in functionality of the integrated circuit (IC). Today, microprocessors support a billion transistors, run at a frequency that is 250X higher than 2 decades ago and provide performance close to a super computer in a handheld device. However, integrating a System on Chip (SOC) has still not been possible due to technical and business reasons. This has led to highly integrated ICs but bulky systems.  Today, the need for including sensing and energy harvesting devices for biomedical and other electronic applications is becoming necessary. These require the integration of nano-materials, nano-sensors and nano-generators into the SOP platform.

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1. Computational electromagnetics tools for EMI/EMC/PI/SI problems
There are various computational electromagnetics tools around for EMI/EMC/PI/SI analysis and each tool has its own pros and cons. In this talk time as well as frequency domain tools are introduced with their capability and limitations.

2. Electromagnetic modeling of high speed mixed signal circuits and interconnects
Accurate and real time modeling of high speed mixed signal circuits and systems as well as high performance interconnects are crucial part for system design. In this talk, systems level simulation schemes are introduced for high frequency mixed signal analysis.

3.  Signal and power integrity issues for GHz printed circuits and systems
Now the EMC regulation reaches a few Giga hertz region and conventional discrete component approaches for SI/PI problems met big huddle. Thus, new innovative approaches are absolute necessary for PCB level SI/PI improvement. This issue and some new ideas will be discussed in this talk.

4.  Localized EBG/meta-material for improvement of signal and power integrity
There are various ideas to minimize PCB level SSN by employing meta-material concept. 
However, most of them are quite impractical for practical applications. Recently, it is
demonstrated that localized meta-material-inspired geometries greatly improve SI/PI performances and these ideas will be discussed in this talk.

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For more information, contact the program chairman:
Bruce Archambeault, Ph.D.
IBM Distinguished Engineer, IEEE Fellow
EMC CoC
919-486-0120
t/l 526-0120
IBM
3039 Cornwallis Rd
B203, Rm A117
RTP, NC 27709
bruce.arch@ieee.org