The IEEE EMC Society
Distinguished Lecturer Program

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Announcing the new Video Distinguished Lecturer Program!
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The EMC Society's Distinguished Lecturer Program (DLP) provides speakers on various aspects of electromagnetic compatibility for EMC Society chapter meetings and similar functions. While presentations to groups outside of the EMC Society and the IEEE are encouraged, the program is not intended for national or international EMC symposiums, regional conventions, local colloquiums, trade shows, or commercial seminars. Speaking engagement arrangements are made by the benefiting organization directly with the Distinguished Lecturer. Scheduling and minimum audience size are at the discretion of the Lecturer.

Distinguished Lecturer Engagements are Subsidized

Each Distinguished Lecturer may present six subsidized or shared expense talks each year. The EMC Society will reimburse Distinguished Lecturer's travel expenses for approved speaking engagements up to a recommended limit of $1,500 per engagement, but this is subject to negotiation and program budget constraints. (When travel expenses for any single trip will exceed this amount, the Lecturer must obtain prior approval before making travel arrangements.)

The EMC Society will reimburse current Distinguished Lecturers up to $2,000 for presentations to EMC Chapters located outside the DL's home continent. Since budget constraints permit few of these trips per year, each trip must be approved in advance by the Distinguished Lecturer Program chairman and the Society's Director of Member Services.

The VP for Member Services may approve an increased funding for Intra-Region, international DL travel (or in other special cases, not covered by the current DL Travel Policy), not to exceed a total of US $2,000 per engagement. Requests for increased funding shall be provided by the DL including due justification and the recommendation of the DL committee chair. Requests for increased funding must be submitted at least 30 days prior to the said engagement. The approval of the VP for Member Services must be obtained prior to finalizing lecture arrangements. The VP for Member Services shall report to the BoD in any such case no later than the following BoD meeting.

Sharing of expenses between the benefiting organization and the EMC Society is encouraged. For example, the benefiting organization could provide local transportation for the Lecturer, provide meals, etc. Benefiting organizations will please give credit to the "Electromagnetic Compatibility Society, Institute of Electrical and Electronics Engineers" in their newsletter or other announcements.

Scheduling a Distinguished Lecturer

1.      Review lecturer list below, then contact lecturer directly to arrange for the engagement:

•  Date, time, and location of the engagement
•  Name and affiliation of benefiting organization
•  Estimated audience size and type (engineers? students?)
•  Topic lecturer will present
•  Discuss what logistical needs can be provided by the benefiting organization (e.g., ground
transportation, meals, handout copying, video display projector, other shared expenses, etc.)
•  Principal benefiting organization contact.

2.      Include summary of talk to be presented and lecturer's bio in the benefiting organization's newsletter or meeting announcement.

Selection of Distinguished Lecturers

The program consists of at least four Distinguished Lecturers, selected by the Program Chairman from written nominations or application from EMC Society members, and approved by the EMC Society Board of Directors. The term for each Distinguished Lecturer is two years. Currently all terms start and end at the turn of a calendar year. Selection is based on (1) professional competence and recognition of EMC expertise, (2) communication and presentation skills, (3) EMC topics, (4) contribution to a balanced program, and (5) recommendation of EMC Society members. Membership in the EMC Society's Distinguished Lecturer program shall not be used in the advertising of products or [consulting] services, nor for any non-approved presentations such as product or training seminars or trade shows. Distinguished Lecturers may not, as part of any DLP presentation, advertise, market, or offer for sale, any commercial product or service.

Distinguished Lecturers

Prof. Dr. Christian Schuster - Sam Connor - Madhavan Swaminathan - Jong-Gwan Yook - Dennis Lewis - Vignesh Rajamani - Vincente Rodriguez - Joseph C. (Jay) Diepenbrock

Prof. Dr. Christian Schuster Technische Universität Hamburg-Harburg    Institut für Theoretische Elektrotechnik   Harburger Schloss Str. 20   21079 Hamburg, Deutschland Tel:         +49 40 42878 3116 E-Mail:  schuster@tu-harburg.de Term: 2012-2013

1. Fundamentals of Signal Integrity and Power Integrity
This presentation gives an introduction to the fundamentals of signal and power integrity engineering for high-speed digital systems with a focus on packaging aspects. It is intended for an audience that has little or no formal training in electromagnetic theory and microwave engineering. Topics that will be addressed include lumped discontinuities, transmission line effects, crosstalk, bypassing and decoupling, power plane effects, return current issues, and measurement techniques.

2. Physics and Modelling of Vias in Printed Circuit Boards
This presentation gives an overview of the current understanding and simulation of electromagnetic fields around vias in printed circuit boards with a focus on the so called physics based via model. It is intended for an audience that has a basic knowledge of electromagnetic theory and network theory. Topics that will be addressed include the physics of parallel plane modes and their impact on via behavior, equivalent circuit models for signal vias, effect of ground vias, and the impact of floating planes on signal transmission.

3. Using the Contour Integral Method for EMC Problems
This presentation summarizes recent advances in the application of the so called contour integral method to EMC problems with a focus on the modelling of wave propagation in parallel plane structures. It is intended for an audience that has some knowledge of electromagnetic theory and its numerical methods. Topics that will be addressed include a review of the basic formulation of the contour integral method, the application to via coupling within parallel planes, the combination with the so called physics based via model, and the hybridization with the method of moments for computation of radiation effects. 

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Sam Connor IBM 3039 Cornwallis Road Research Triangle Park, NC, USA 27709 sconnor@us.ibm.com Term 2012-2013

1. Automated EMC Design Rule Checking: Past, Present, and Future
The complexity of circuit boards and systems has risen dramatically over the last couple decades, along with the data rates of the signals being used. At the same time, development cycles have compressed, and teams have been divided across time zones and continents. In the past, manual reviews of circuit boards and system wiring were possible in the time available, and EMC engineers could share design guidelines with board designers down the hall. Nowadays, design guidelines must be accessible worldwide, instantaneously, and they need to be checked in a repeatable manner to ensure quality. As technology changes, new rules must be developed quickly based on lessons learned and simulation results. These demands have driven the need for automated, customizable rule checking applications. Up until now, these applications have focused on electrical designs, as this is typically viewed as the source of EMC problems. Looking ahead, though, this methodology needs to be applied to all aspects of a system design if it is going to identify the system-level integration issues that often derail products during certification testing.

2. Differential Signaling Is the Opiate of the Masses
A large concern with the proliferation of differential signaling is the false sense of
security that comes along with its usage. Differential signals are hailed for their immunity to noise coupling and for their propagation characteristics. Differential receivers have great common mode rejection, and with equalization, receivers can pull meaningful signals out of a closed eye diagram. But with all of these benefits, the often forgotten drawback is that differential signals on PCBs are not truly differential and they do not perfectly cancel. The various asymmetries in the routing of the differential pair and the impedance discontinuities of vias and connectors and the imbalance and skew of the drivers all create a common mode signal on the differential pair that can cause serious EMC problems when coupled to other nets or radiated from cables and connectors.

3. Effective Use of Full-wave Models to Evaluate Design Tradeoffs
The demands of schedule and cost for most electronic products do not allow for multiple design iterations, so EMC engineers can no longer wait for hardware to be built and measured in the EMC lab before making design change recommendations. EMC engineers can participate sooner in the product development process if they are comfortable with the full-wave modeling tools available today and if they understand the tools’ limitations. This presentation discusses various modeling approaches and gives many practical examples of how simulations can help one understand the impact of specific design features on the overall EMC performance of a system. It will also show how the results can add credibility to their design change

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Madhavan Swaminathan Georgia Institute of Technology, Atlanta 404.894.3340 madhavan.swaminathan@ece.gatech.edu Term 2012-2013

1. Designing for Power Integrity: Status, Challenges and Opportunities
Since the mid-1990s, designers have been developing sophisticated methods for managing power integrity in packages and printed circuit boards which has had a direct impact on the signal integrity of systems. These have included items such as developing design parameters such as target impedance, developing repeatable frequency domain characterization methods, pushing the EDA vendors to improve the capability of the design tools, developing new devices such as EBGs to improve isolation, developing embedded capacitance layers to name a few. However, the designers are continuing to face challenges where the noise on the power distribution is beginning to over shadow the signals in fast switching environments arising in high speed computing systems. These challenges are often times opportunities for university research that can lead to interesting and often times innovative solutions.  This talk will cover a review of the past developments in this area and will focus on the present challenges and potential solutions in the area of power delivery.

2. Multi-scale and Multi-physics modeling: Their role in 3D Integration
Over the last several years, the buzzword in the electronics industry has been “More than Moore”, referring to the embedding of components into the package substrate and stacking of ICs and packages using wirebond and package on package (POP) technologies. This has led to the development of technologies that can lead to the ultra-miniaturization of electronic systems with coining of terms such as SIP (System in Package) and SOP (System on Package). More recently, the semiconductor industry has started focusing more on 3D integration using Through Silicon Vias (TSV). This is being quoted as a revolution in the electronics industry by several leading technologists. 3D technology, an alternative solution to the scaling problems being faced by the semiconductor industry provides a 3rd dimension for connecting transistors, ICs and packages together with short interconnections, with the possibility for miniaturization, as never before. The semiconductor industry is investing heavily on TSVs as it provides opportunities for improved performance, bandwidth, lower power, reduced delay, lower cost and overall system miniaturization. A major bottleneck today for 3D system implementation is in the Electronic Design Automation (EDA) area.  In this talk, challenges in the design of 3D ICs and packages with a focus on design automation relating to multi-scale and multi-physics effects will be presented.

3.  Micro and Nano miniaturization of systems
The main driver for the semiconductor industry has been Moore’s law where the doubling of transistors has led to phenomenal increase in functionality of the integrated circuit (IC). Today, microprocessors support a billion transistors, run at a frequency that is 250X higher than 2 decades ago and provide performance close to a super computer in a handheld device. However, integrating a System on Chip (SOC) has still not been possible due to technical and business reasons. This has led to highly integrated ICs but bulky systems.  Today, the need for including sensing and energy harvesting devices for biomedical and other electronic applications is becoming necessary. These require the integration of nano-materials, nano-sensors and nano-generators into the SOP platform.

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Jong-Gwan Yook School of Electrical and Electronic Engineering College of Engineering Yonsei University Seoul, Korea 120-749 email: jgyook@yonsei.ac.kr Term 2012-2013

1. Computational electromagnetics tools for EMI/EMC/PI/SI problems
There are various computational electromagnetics tools around for EMI/EMC/PI/SI analysis and each tool has its own pros and cons. In this talk time as well as frequency domain tools are introduced with their capability and limitations.

2. Electromagnetic modeling of high speed mixed signal circuits and interconnects
Accurate and real time modeling of high speed mixed signal circuits and systems as well as high performance interconnects are crucial part for system design. In this talk, systems level simulation schemes are introduced for high frequency mixed signal analysis.

3.  Signal and power integrity issues for GHz printed circuits and systems
Now the EMC regulation reaches a few Giga hertz region and conventional discrete component approaches for SI/PI problems met big huddle. Thus, new innovative approaches are absolute necessary for PCB level SI/PI improvement. This issue and some new ideas will be discussed in this talk.

4.  Localized EBG/meta-material for improvement of signal and power integrity
There are various ideas to minimize PCB level SSN by employing meta-material concept. 
However, most of them are quite impractical for practical applications. Recently, it is
demonstrated that localized meta-material-inspired geometries greatly improve SI/PI performances and these ideas will be discussed in this talk.

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Vignesh Rajamani email: vignesh.rajamani@okstate.edu Term 2013-2014

1. A practitioners approach to EMC testing with reverberation chambers
This talk discusses the efficiency of reverberation chambers to perform emissions and immunity tests. The statistically isotropic, randomly polarized, and uniform electromagnetic environment present inside a well stirred reverberation chamber enables a robust, all aspect angle test. The controllable uncertainty of a reverberation chamber test method provides the test engineer options to design a test depending on whether the test is a simple product qualification test or a mission critical system test.

2. Computational verification of reverberation chambers – do's and don'ts
More often we see simulation of reverberation chambers using different numerical techniques like moment methods and finite difference time domain. This talk focusses on what are the do’s and don’ts when it comes to simulating a reverberation chamber and estimating the performance of the reverberation chamber from simulated data. Given enough computational power, any size of a RC can be simulated at any frequency but with a limited computational resource how we achieve a RC like simulation, will be discussed.

3.  Comparison of radiative test facilities
This talk covers the physical characteristics, the test electromagnetic environment, and the advantages and disadvantages of the following radiative test facilities: Open Area Test Site (OATS), Partially and Fully Absorber Lined Chambers, Reverberation Chambers, Transverse Electromagnetic (TEM) Cells, Gigahertz Transverse Electromagnetic (GTEM) Cells.

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Vincente Rodriguez email: rodriguez@ieee.org Term 2013-2014

1. Introduction to antenna parameters and Antennas for EMC
This presentation starts with a description of different antenna parameters using movies and graphics to visualize the different features of a radiating antenna. The presentation follows with an overview of the different types of antennas used in EMC to perform EMC measurements

2. Automotive EMC: Components and full vehicle
This presentation is a short survey of  the main emissions and immunity for automotive components and full vehicle. The test site requirements for CISPR 12, CISPR 25, ISO 11451 and ISO 11452 are discussed and presented.

3. Anechoic Chambers and Absorber
This is a presentation on the basics of anechoic chamber design and simulation. Samples of designs for CISPR 16, CISPR 25, MIL-STD 461 and RTCA DO 160 are given. An introduction on absorber technology is also presented.

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Joseph C. (Jay) Diepenbrock email: jdiepenb@earthlink.net Term 2013-2014

1. Signal Integrity Characterization, parameters and techniques
This presentation will focus on the key electrical parameters that are important to understand and measure for ensuring optimum performance in today’s high speed serial communications interfaces.  These include fundamental quantities such as inductance, capacitance, and propagation delay as well as “derived” quantities of impedance, insertion and return loss, skew, crosstalk, etc.  Software tools for extracting these parameters will also be discussed.

2.  High Speed Serial Link Design

This presentation discusses some of the key electrical properties that affect the performance of high speed serial channels and what affects them.  It covers insertion and return loss, loss mechanisms, and the influences of various packaging elements including printed circuit board materials, connectors, cables, and vias.  The benefits of equalization in lossy channels will be discussed.  Test equipment and techniques for characterizing serial channels will be covered as well as software tools for simulating channel performance.

3. High performance data cables

This presentation deals with the design, manufacturing, and testing of high performance data cables.  A number of examples will be described illustrating different types of cables for typical applications.  Characteristics of various types of materials, construction considerations, various connectors, and termination techniques will be covered, as well as testing considerations.

4. Industry standards overview

This presentation gives an overview of the “PHY” layer of some of the many data communications standards in use today.  These standards include Ethernet, InfiniBand, PCI-Express, Serial Attached SCSI (SAS), Serial ATA (S-ATA), HDMI, DisplayPort, Thunderbolt, and others.  Physical attributes including lane widths, data rates, connectors used, maximum length, data coding, and some system considerations will be compared and contrasted.

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Dennis Lewis email:dennis.m.lewis@boeing.com Term 2013-2014

1. Introduction to Reverberation Chamber Concepts and its Application for Probe Calibration and Antenna Efficiency Measurements
Abstract: This presentation gives a brief introduction of current methods used to calibrate electric field probes as defined by IEEE Standard 1309 as well as a brief discussion of some inherent problems with the current test methods. The use of a reverberation chamber to calibrate electric field probes is described as an alternative method along with some of the tradeoffs between methods. The use of modal, spatial, and frequency averaging to improve field uniformity levels to that required for accurate antenna efficiency characterizations are also outlined.

2. The Impact of Cables and Connectors on Radio Frequency and Microwave Measurement Uncertainties
Abstract: Microwave test and measurement equipment is used for many applications, including component measurements, electromagnetic compatibility testing, metrology and wireless environment assessments. Much of this equipment requires special care and consideration in order to eliminate damage and maintain a high level of accuracy. When developing these high frequency measurement systems and evaluating system performance, it is common to consider the warranted equipment specifications. Very often, however, the error contribution of cables and connectors to the system uncertainty is overlooked. Impedance mismatch is typically the largest source of measurement error and is largely influenced by the cables and connectors used within the system. Something as insignificant  as a $30 connector can adversely affect the performance of a system costing several hundred thousand dollars. This presentation provides an overview of commonly used cables and connectors and discusses some of the errors associated with them. The impact of these errors on overall measurement system uncertainties is discussed. The presentation finishes with some practical examples and real world applications to help guide participants in the selection and use of cables and connectors and more accurately assess system performance.

3. Utilizing Reverberation Chambers as a Versatile Test Environment for Assessing the Performance of Components and Systems
Abstract: Electromagnetic reverberation chambers have been used for many years by the Electromagnetic Compatibility (EMC) community to measure the susceptibility and emissions for various electronic components and systems. This presentation describes how statistical processes were used to reduce the uncertainty of these chambers to a level necessary for precision metrology applications. These processes were applied to the calibration of electromagnetic field probes and the assessment of antenna efficiencies. A brief comparison of traditional calibration methods employing transverse electromagnetic (TEM) cells and anechoic chambers to the new statistical reverberant environment will be shown.
The presentation also goes on to explain how these techniques were later applied to a wide variety of aircraft measurements. A technique which utilizes two side by side reverberation chambers sharing a common wall with an arbitrary shaped aperture, useful for the assessment of component shielding, will be discussed.  Utilizing this same approach, it is possible to assess the shielding of large structures such as commercial aircraft.  These aircraft shielding measurements are necessary for High Intensity Radiated Field Susceptibility (HIRF) certifications.
        With the proliferation of wireless devices it is important to understand how they behave in complex electromagnetic environments and how they interact with other devices and systems in which they are collocated . Aircraft environments have been shown to behave similarly to reverberation chambers and therefore these techniques can be employed to study propagation environments and system interactions. This presentation will give examples of how these techniques were employed to measure bulk absorption used to simulate passenger loading of aircraft, field mapping which is useful for the evaluation of signal coverage and channel interference as well as signal propagation characteristics.

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For more information, contact the program chairman:
Bruce Archambeault, Ph.D.
IBM Distinguished Engineer, IEEE Fellow
EMC CoC
919-486-0120
t/l 526-0120
IBM
3039 Cornwallis Rd
B203, Rm A117
RTP, NC 27709
bruce.arch@ieee.org