An Example of Why Military EMI Qualification
is a Serious Issue
Patrick André (of André
Consulting) tells the story of how he got his start in EMC.
He was hired, in part, to investigate a serious problem
with the engine controller on a Navy ship. The ship was
headed for sea trials in the North Pacific and passing through
the Strait of Juan de Fuca. The Captain ordered ship to
shore communication of the ship's status. Immediately after
the radio transmission began, the ship's engines shut down.
Needless to say, the captain was not delighted about this
feature. Upon investigation (back at the Naval base), the
problem was found to be a combination of hardware and software
controls. The ship was equipped with two screws (propellers
to those who are not sea worthy). Each screw shaft had a
torque sensor to measure the force applied to the screws.
When the command from the bridge was given to sail straight,
the software would adjust the engines to maintain equal
torque. One of the torque sensors was located directly under
the transmitting antenna for the ship-to-shore radio. When
keyed, the sensor readings were greatly exaggerated. To
compensate, the engines were reduced until the readings
equalized. The software quickly backed the engines all the
way off, and the readings would not equalize. As you can
understand, the ship's Captain and other Navy commanders
were quite concerned about a system failure that would cause
a ship to become 'dead in the water.' The problem was solved
by placing a few capacitors from line to chassis on the
signal and DC power lines. The fix was incredibly simple
for the severity and consequences of the problem.
|Doug Smith projects information on IC
package noise at the Central New England Chapter meeting.
Boston (Central New England)
John Clarke, Chapter Chair, reports that one meeting has been
held by the CNE Chapter since the last issue of the EMC Newsletter.
On Wednesday, May 21, Doug Smith, of D.C. Smith Consultants, Los
Gatos, California presented, "Troubleshooting IC Package
Noise." Parasitics in IC packages can affect the performance
of the chip inside, particularly when a new technology chip replaces
an existing custom chip in the same package. Such a combination,
a new chip in an old package, has been a source of many working
weekends on the part of an engineer trying to track down the resulting
problems. A simple effective way of evaluating if an IC package
and chip combination is robust was presented. The procedure can
be performed in an hour or two and the results will determine
if the chip and package combination is robust or not. All that
is required is a scope, a paper clip (or other stiff wire) and
a suitable voltage probe. To illustrate the principles involved,
a live demonstration was made on a chip mounted on a working modem
board. The meeting was attended by 15 members and 7 guests. The
next meeting will be held in September. This is usually a joint
meeting with the Northeast Product Safety Society (NPSS). The
joint EMC-PSTC meetings have been held annually since 1997. In
the meantime, the Boston 2003 Committee members are very busy
with preparations for the Symposium scheduled for August 18 to
22. Most of the committee members and volunteers are CNEC EMCS
|Central Texas Chapter officers Jim Greenwood
of Airep, Dianne Brown of ETS-Lindgren, and Rich Worley of
Dell Computer (from left) congratulate Diane Kempf of the
Naval Air Warfare Center for winning the big prize: a digital
camera! There to lend support was Mike Hatfield (far right),
Technical Program Chair for the 2003 Reverberation Chamber,
Anechoic Chamber, and OATS Users Meeting. The Chapter sponsored
the raffle that was held during the reception celebrating
the successful conclusion of the three-day conference.
|Mike Hatfield (foreground right) of the
Naval Surface Warfare Center in Dahlgren, Virginia held court
during the 2003 Reverberation Chamber, Anechoic Chamber, and
OATS Users Meeting in Austin. And why not, he's "Mr.
Reverb" in the industry!
|Italian EMC engineers were well represented
in Austin. The "Father of Reverb", Paolo Corona
(left) from the Naval University of Naples, joined Monica
D'Urso from Alenia Aeronautica and her husband, Paolo Torazzo,
at a traditional Texan barbecue following the workshops held
in conjunction with the 2003 Reverberation Chamber, Anechoic
Chamber and OATS Users Meeting.
|Janet O'Neil of ETS-Lindgren, Tim Stevens
of Dell Computer and Betty Robertson of Lyncole XIT Grounding
(from left) enjoyed meeting the Central Texas Chapter members
as well as the international gathering of engineers that attended
the 2003 Reverberation Chamber, Anechoic Chamber, and OATS
|Tom Hampton of Laird Technologies was
an enthusiastic lunch sponsor for the 2003 Reverberation Chamber,
Anechoic Chamber, and OATS Users Meeting tabletop exhibition.
|Ross Carlton of Motorola (left) enjoyed
visiting with Toni Gurga of Credence Technologies during the
tabletop exhibition organized by the Central Texas EMC Chapter
during the 2003 Reverberation Chamber, Anechoic Chamber, and
OATS Users Meeting.
|These engineers found a common bond in
GTEM test methodology during the Austin meeting. Shown from
left are Bill McDade of Corning Gilbert, David Wilson of C&D
Technologies, Garth D'Abreu of ETS-Lindgren and John Ladbury
|It's not everyday you attend an EMC conference
and get to see a major studio filming! "The Alamo"
with Billy Bob Thorton was filming during the 2003 Reverberation
Chamber, Anechoic Chamber, and OATS Users Meeting in downtown
Austin across the street from the Intercontinental Hotel,
site of the conference.
|Ken Baker of Amplifier Research welcomed
Central Texas Chapter members Bob Ripley of Austin EMC and
Greg Jurrens of Test Tech (from left) to his booth during
the tabletop exhibition.
|Jim Ott (left) and Norio Sasaki from
TDK were on hand to showcase their products and services during
the Central Texas Chapter event in downtown Austin on April
|Richard Worley, Chair of the Central
Texas EMC Chapter, enjoys the sunshine of Austin from the
balcony of the Intercontinental Hotel. Note the State Capitol
in the background. They say everything is bigger in Texas
and that's true in the case of the Capitol building. Modeled
after the Washington DC Capitol, it is 10' taller!
Some 60 engineers dedicated to reverberation
chamber, anechoic chamber and OATS testing methodology came to
Austin, Texas over April 28-30 for the 2003 Reverberation Chamber,
Anechoic Chamber and OATS Users Meeting. The engineers represented
nine countries and a diverse mix of commercial and government
organizations. This "think-tank" of leading industry
experts convenes every 12 to 18 months to share the latest research
undertaken in this specific area. Michael O. Hatfield of the Naval
Surface Warfare Center in Dahlgren, Virginia, Janet O'Neil of
ETS-Lindgren in Cedar Park, Texas, and Mike Windler of Underwriters
Laboratories in Northbrook, Illinois again teamed for their third
effort in sponsoring and organizing this unique three-day event.
The meeting started with a series of hands-on workshops at the
ETS-Lindgren facility nearby. Attendees participated in workshops
dedicated to reverberation chambers, GTEMs, and instrumentation
uncertainty on an OATS. Technical material presented was enhanced
with hands-on demonstrations using "real" equipment,
such as ETS-Lindgren's full vehicle sized reverberation chamber.
ETS-Lindgren hosted a traditional Texan style barbeque following
the workshops complete with a frozen margarita machine. Horseshoes
and a golf range were available for guests to play nearby their
OATS. Following the workshops were two days of technical presentations
held at the historic Intercontinental Hotel in downtown Austin.
An awards banquet was held one evening to recognize the "best
paper" presented by Tim Harrington of the FCC. His paper
provided an update on informal laboratory comparison of reverberation
chamber, GTEM, FAR and OATS using refrad and EU FAR project simple
EUT. The final day of the presentations featured an informal tabletop
exhibition by over 20 vendors of EMC related products and services
in a neighboring ballroom. Organized by the Central Texas Chapter
of the IEEE EMC Society, this exhibition perfectly complemented
the technical presentations. Chapter Chairman Richard Worley of
Dell Computer Corporation was on hand along with Chapter Webmaster
Tim Stevens, also of Dell Computer Corporation, to ensure attendees
were able to visit the vendors and get the latest information
in advancing EMC technology. However, behind the scenes it was
Chapter Secretary Mark Prchlik of Laird Technologies Company that
directly handled the exhibition, along with the able help of Chapter
Event Coordinator Dianne Brown of ETS-Lindgren. The Chapter's
Steering Committee, including Ed Bronaugh and Bob Hunter, as well
as Chapter Vice-Chair Jim Greenwood of Airep Electronics also
participated. Mr. Bronaugh, of EdB EMC Consultants, in particular
contributed his expertise on measurement uncertainty to one of
the workshops. It was a full three days of diverse activities
that kept the meeting lively and informative. All agreed it was
one of the best meetings held to date with this group!
|Frank Krozel, the 2003 IEEE EMC Chicago
MiniSymposium Chairman, introduces speaker Mike Hopkins of
Thermo KeyTek (left).
|Kevin Baldwin of ETS-Lindgren (left),
was presented with a speaker appreciation award by Ray Klouda,
Chicago Chapter President during the 2003 IEEE EMC Chicago
|Ray Klouda, Chicago Chapter President
(left), presents DLS Electronics' Roger Swanberg with the
Chapter's "Person of The Year Award."
|Sean Emerson of Rohde & Schwarz speaking
to attendees at the Chicago MiniSymposium.
|John Whitney of Amplifier Research (center)
appears with a MiniSymposium attendee and Mike Keppert of
Electronic Instrument Associates (right) at Chicago's MiniSymposium.
|Mike Keppert of Electronic Instrument
Associates' Wisconsin office takes time to visit the EM Test
booth at the 2003 IEEE EMC Chicago MiniSymposium.
The Chicago Chapter held their annual MiniSymposium on May 20
and it was well attended. Although the Chicago marketplace is
still struggling, the EMC engineers were optimistic and eager
to learn from the speakers! The technical paper topics were selected
to address the local needs of our marketplace. We look forward
to a good year for EMC in the Chicago area. We plan to have another
MiniSymposium next year, in the same place on Tuesday, May 18,
Editor's Note: Subsequent to submitting this text for Chapter
Chatter, Frank Krozel shared the sad news on the passing of Michael
Keppert, 42, shown in these Newsletter photos. Mike worked with
Frank for many years and was a pleasant personality at EMC Chapter
events in Chicago and Milwaukee. He passed away from injuries
sustained in a highway accident when a tire came off a pickup
truck and crashed through his windshield on the driver's side.
Friends of Keppert described him as generous and a man of faith.
"Mike donated money anonymously to help people who were adopting
children with special needs," said Ingrid Schlueter, host
of the radio program "Crosstalk" on WVCY-FM (107.7).
Schlueter's radio program broadcasts a weekly feature on a child
with special needs waiting to be adopted. Many times Keppert e-mailed
or called her after the programs to assure her that if money was
an obstacle to people interested in an adoption, he would help,
Schlueter said. Keppert was on a business trip when the fatal
accident occurred, said his wife, Sally, who is expecting the
couple's first child in November. Frank Krozel has started a Trust
Fund for the baby along with members of the Keppert family. Donations
may be sent to: Sally Keppert, c/o Electronic Instrument Associates
- Central, Inc., 123 East Lake St., Suite 300, Bloomingdale, IL
Dr. André Berthon reports that the French Chapter held
a meeting on April 25th at the Institut Supérieur d'Electronique
de Paris. The meeting was devoted to reports on recent EMC work
and included four presentations, followed by a discussion. The
presentation titles were "Electromagnetic Cartography Test
Bench" by François de Daran of VALEO, "Wide Band
Dipolar Probe for Monitoring of Reverberation Chambers",
"Lowering of the RCS of an Anechoic Chamber" by Gil
Cottard of ANTEM, and "Invention for the Cancellation of
Cross Talk in Interconnects" by Frédéric Broydé
The Mohawk Valley Joint EMC/Reliability Chapter wound down its
meeting and guest speaker engagements for the first half of this
year. Chair Irina Kasperovich is making arrangements to host Distinguished
Lecturers for the remaining luncheon meetings this year, which
will resume after the summer hiatus. The recent meetings have
been successful and well attended due to an excellent array of
guest speakers, complimentary pizza and beverages, CD collections
of our EMC symposia proceedings available upon request at the
meetings, and the growing interest in EMC topics in the information
age. The major activity this past term was the Annual Mohawk Valley
IEEE Section and St. Lawrence Subsection Awards Banquet-an event
at which many of the Section's worthy award recipients are recognized
for their various contributions and accomplishments to the local
technical and professional community. The Awards Banquet was held
on 30 April. The Section awarded Sharon Hall the Charles A. Strom
Engineering Award. Sharon is an IEEE Student Member and belongs
to the IEEE EMC and Computer Societies. She is also an active
member in the IEEE Student Branch at the SUNY Institute of Technology
in Marcy, New York. The Engineering Recognition award is named
in honor of Charles A. Strom, a highly respected electrical engineer
throughout the world for his pioneering efforts and contributions
in the art, science and practice of communications. Charlie spent
the last 47 years of his life in Central New York promoting and
advocating engineering at work, through professional activities,
and as an adjunct Professor at the SUNY Institute of Technology.
He held the distinguished grade of Life Fellow of the IEEE, it
highest grade, and was a founding member of many of its national
level, technical societies. Up to two awards are given annually
to recognize and reward students who demonstrate outstanding talent
in engineering related math and sciences and who are pursuing
a degree in computer, electronic or electrical engineering or
engineering technology. Sharon recently received a B.S. Degree
in Computer Science from SUNY IT and is in the process of obtaining
her M.S. in Computer Science also from SUNY IT. Congratulations
|The EMC Fest 2003 Orange County Organizing
Committee (from left) Randy Flinders of Emulex Corp., Robert
Tozier of CKC Labs, Janet O'Neil of ETS-Lindgren, Ed Nakauchi
of Laird Technologies, and Rick Candelas of Aegis Labs.
|The Hi-Tech Audio/Visual presentation
allowed the audience to view real-time demonstrations and
experiments illustrating the concepts presented during EMC
Fest 2003 Orange County.
|The state-of-the-art meeting room for
EMC Fest 2003 Orange County offered an illuminated work surface
and power ports to all attendees.
|W. Michael King and Douglas C. Smith
were the featured speakers at EMC Fest 2003 Orange County
on June 12th.
|Lunch sponsors Allen and David Fischer
of Fischer Custom Communications visit with Reception sponsor
Jerry Page of Northwest EMC (from left) at the exhibition
held during EMC Fest 2003 Orange County.
Randy Flinders, Chapter Vice-Chair, reports that it was a cool,
overcast day on June 12th, 2003, when about 80 EMC professionals
from Orange County, California and the surrounding regions converged
on the Irvine Hyatt Regency Hotel. They were all gathering together
to attend EMCFest 2003 - Orange County, hosted by the Orange County
EMC Chapter. The Program: W. Michael King and Douglas C. Smith
gave a one-day talk entitled "Electromagnetic Compatibility
- Black Magic Dispelled (and Replaced with Basic Physics)."
It was an excellent program which incorporated several real-time
experiments designed to drive the concepts presented home to the
attendees. Instead of the typical format where each speaker prepares
and covers a separate section, both speakers interacted throughout
the presentation, from conception through closing remarks. The
Setup: The meeting room was outfitted with stadium style seating,
with personal lamps and power ports provided to each attendee.
The Audio/Visual setup was unprecedented at an EMCFest event,
utilizing a room-width screen, two LCD projectors, a notebook
PC, a video camera, an Agilent Oscilloscope, and "video switching
technology." (O.K. - it was just one of those VGA switches.)
The setup allowed the audience to view the experiments in real
time with the results (scope trace) up for all to see. This was
very well received and really brought the presentations to life.
The Participants: It was not just the technical presentation that
brought so many EMC professionals out of their cubicles! At EMCFest
2003, there were over 20 of the leading providers of EMC products,
services, and test equipment on hand with the latest technology
on display. The EMCFest 2003 organizing committee would like to
give a special thanks to Fischer Custom Communications for sponsoring
the lunch, and to Amplifier Research, Northwest EMC, and Rohde
& Schwarz for sponsoring the reception! Also, special thanks
to ETS-Lindgren for loaning out Janet O'Neil! The Raffle: If the
technical presentation didn't bring them in, and the surplus of
information on the latest EMC products and services didn't do
it, then it may have been the amazing raffle prizes that brought
some folks from as far away as Eugene, Oregon. Congratulations
to Carl Vogelsang of Boeing, winner of the Sony 3 mega-pixel digital
camera, Mario Robles of Boeing, winner of the EMCT EMC training
software package, and to Michelle Radpour, the Com-Power near
field probe set winner! This outstanding raffle would not have
been possible if not for the generous prize donations from Aegis
Labs, Elliott Labs, and Com-Power Corporation. If you missed EMCFest
2003 - don't worry! The Los Angeles EMC Chapter will be sponsoring
a similar event next Spring. In the meantime, visit www.ieee.org/oc-emc
for the latest updates in EMC related events in the Orange County,
|Members of the Oregon-SW Washington chapter
gather prior to the ITE update presentation by Bruce Harlacher
of Fischer Custom Communications.
|Bruce Harlacher of Fischer Custom Communications
before his April presentation to the Oregon-SW Washington
|Dr. Cheung-Wei Lam from Apple Computer
presented EMC design issues to the Oregon-SW Washington chapter
Dave Britton, the Vice Chair of the Oregon and SW Washington chapter
reports that the April 30th meeting with Bruce Harlacher of Fischer
Custom Communications, Inc was a big hit. His presentation was
entitled, "CISPR 22: Radiated and Conducted Emissions Testing
for Information Technology Equipment, What's Happening with the
4th Edition Due August 2003? Plus, Just How Does CISPR Operate?"
The presentation was well attended. We look forward to hearing
more from Bruce and his continuing work on CISPR issues. Our thanks
go to Fischer Custom Communications for supporting Bruce's visit.
At the May 21st chapter meeting, Distinguished Lecturer Dr. Cheung-Wei
Lam from Apple Computer gave a paper entitled, "Signal Integrity
Design versus Radiated Emission Control." The attendees thoroughly
enjoyed the presentation and many questions were asked. Dr. Lam
presented a number of subtle design points that can seriously
impact EMC performance. The Oregon-SW Washington Chapter also
held an election for the 2003/2004 chapter officers at the May
21st meeting. The current officers ran again as candidates for
the coming term. The new officers are Derick Skouby as Chair,
David Britton as Vice Chair, William Owsley as Treasurer, Chuck
Britten as Secretary, Camille Good as Communications Director
and Varuzhan Kocharyan as the Membership Director. We have scheduled
Chris Kendall, EMCS Distinguished Lecturer, of CKC Laboratories,
to speak at our fall kickoff meeting at the end of September.
Chris does a great presentation so be sure to put this one on
your calendar. For details on the date and time, check our website
in September at: http://www.worldaccessnet.com/~emc/
|Bruce Wallick of Tektronix highlights
the need to lay out PC Board traces as transmission lines
for high-speed signals to the Phoenix Chapter.
Harry Gaul, Chapter Chair, reports that the Phoenix EMC Chapter
was pleased to welcome Bruce Wallick, Field Applications Engineer
for Tektronix, on April 3rd. Bruce presented a talk entitled "Signal
Integrity in Measurement Systems." Bruce began his talk with
a review of today's faster (and ever faster) digital signals including
Firewire (IEEE 1394b), with speeds up to 1.6Gbps. Because of these
very high speeds, digital signals can be thought of as switching
analog signals. Bruce also made the point that EMI and crosstalk
increases as the edge rate increases. To mitigate these problems,
signal traces should be routed as controlled impedance transmission
lines with either source or load end termination. As an example,
if a signal has 1ns edge rates, then any trace exceeding 3cm in
length should be routed as a transmission line. Bruce completed
his talk with recommendations concerning the proper choice of
oscilloscope and probe bandwidth so as to ensure valid measurements
of fast rise time signals. In general, the 3dB measurement bandwidth
should be greater than 0.35/tr where tr is the signal rise time.
The presentation materials from this meeting as well as announcements
for future meetings are available on the Phoenix EMC Chapter Web
site at http://www.ewh.ieee.org/r6/phoenixphoenixemc/.
|Lee Hill explains an EMC concept during
his May presentation in Colorado.
|Charles Grasso (right), Vice-Chair of
the Rocky Mountain Chapter, thanks Lee Hill of Silent Solutions
for his presentation.
|Chris Kendall of CKC Labs explains Military
Emissions requirements to the members of the Rocky Mountain
|Matt Aschenberg of Echostar Technologies
is shown explaining the finer points of prediction at the
May meeting of the Rocky Mountain Chapter.
|The audience asked many questions during
Chris Kendall's presentation.
|Matt Aschenberg (left) and Charles Grasso
(right) thank speaker Colin Brench of Hewlett Packard.
|Bob Reinert, Chapter Chair, with Storage
Technology, (far left) and Charles Grasso, Chapter Vice Chair,
thank Chris Kendall for his June presentation to the Rocky
|Bill Ritenour of EMC Compliance, LLC
addresses an expectant group at the January Rocky Mountain
|At his May presentation in Colorado,
Dr. Bruce Archambeault of IBM reaches high to make his point.
|Bob Johnk of NIST gave his "Ultrawideband
Metrology" presentation at the IEEE Technical Symposium
of the Rocky Mountain Chapter.
|Matt Aschenberg (left) and Charles Grasso
(right) thank Bill Ritenour.
|Colin Brench begins his presentation
marathon at the Rocky Mountain Chapter's February meeting.
Charles Grasso, Vice Chair, reports that 2003 has thus far been
very active for the Rocky Mountain Chapter of the EMC Society.
The winter sessions kicked off on January 23 with "Power
Distribution System Decoupling - How 'Bout Them Vias?" delivered
by T.J. (Bill) Ritenour. The power distribution system of a printed
circuit board is a vital if unglamorous component in the struggle
to maximize signal integrity while simultaneously minimizing radiated
emissions. As circuit speeds increase, faster signal edges cause
larger and larger consequential Simultaneous Switching Noise (SSN).
This is due to the faster current transitions that must flow through
the Power Distribution System (PDS) and on to the logic devices
that draw power from it. The PDS-logic device paths are inherently
inductive, and, in a typical PWB, significant levels of Ldi/dt
noise will abound. This talk covered some of the basic elements
of the PDS power and ground planes before focusing on vias, decoupling
capacitors, pad layouts and the equivalent inductance of the decoupling
current paths. Inductance minimization methodologies applied to
oscillator and logic circuits were presented. The Chapter's February
meeting was an impromptu delivery by Colin Brench of Hewlett Packard
titled "Antenna Behavior and Use - (What Really Goes on During
a Test?!)" and "Understanding EMI Shield Behavior in
Real Product Environments." The officers of the RMC EMC Chapter
would like to thank Colin Brench for delivering two papers in
an EMC double header. Some brave souls defied the elements (yes,
it actually snowed!) and benefited from two excellent presentations.
In the first presentation, "Antenna Behavior and Use - (What
Really Goes on During a Test?!)," Colin explored the history
of measurement techniques and looked at the magnitude of the errors
introduced, and showed how, through the use of computational techniques,
this problem is slowly being addressed. The first anomaly that
Colin explored was the ubiquitous Antenna Factor. In a classic
case of bureaucracy overcoming physics, Colin showed how having
a constant antenna factor is really incorrect when testing an
actual product. One attendee (much to the dismay of others) commented
that if this test metric was properly implemented that, "we
would end up with more failing products!" Colin then explored
the behaviors of a number of different antennas in the EMC test
environment and showed the errors involved as a result of the
disconnect between the ways the antennas are designed, used and
calibrated. All in all, it was a very informative and illuminating
discussion. In a feat of speaker fortitude, Colin, after only
a five minute break, presented "Understanding EMI Shield
Behavior in Real Product Environments." As EMC engineers,
we know that EMI shielding is a mainstay of EMI control. Frankly,
without it, regulatory life would be very difficult indeed. However,
there are often opposing requirements imposed on an enclosure's
design. The EMC engineer tries hard to have no holes or slots
but then the mechanical engineer insists on adding holes and slots
to cool the electronics. In Colin's second presentation, he used
test data and modeling to demonstrate and explain some commonly
seen, but often misunderstood shielding problems. Typical cases
were presented including the effects of internal and external
cables when located close to an array of apertures. Any proximal
conductors can influence the shielding performance of an enclosure,
and can create windows where the shielding is much lower than
anticipated resulting in excessive emissions. Colin also demonstrated
the errors of using the existing SE equations. He further elaborated
that there may be situations when an EMI shield can be working
much better than thought; under these conditions, larger apertures
are possible. To round off the evening, Colin showed some nifty
simulation animations that showed the effects of cables, slots
and even mounting ears. Thanks Colin for a great show! The March
Rocky Mountain Chapter meeting was incorporated into the IEEE
Denver Technical Symposium. The symposium was held at Denver University
and was hosted by IEEE Section 5. In a show of support for the
RMC EMC chapter, three scientists from the National Institute
of Standards & Technology, RF Technology Division, located
at Boulder, CO gave up one of their weekend days to present papers
at the IEEE Denver Technical Symposium. First up was Robert Johnk
with "Ultrawideband Metrology at NIST." Bob presented
a nice summary of the theory and some of the promise for ultrawideband
measurement systems. He relayed that a single event contains all
the information of the unit under test. Gated properly, it is
possible to test in non-ideal test locations and still make meaningful
measurements. Some applications for Wideband Metrology are Precision
Antenna Calibrations, characterizing scattering and propagation
in measurement facilities and airframe shielding and cabin propagation.
Next up was Chriss Grosvenor who presented "TEM Horn Antenna
Design: Theory and Simulation." Integral to the ultrawideband
metrology technology is the TEM horn antenna and Chriss showed
some of the design intricacies that can be modeled and measured
to understand and build an efficient design. Last, but not least,
was David Novotny with "Ultrawideband Diagnostic Imaging
of EMC Facilities." Using this technology, the accurate mapping
of a test facility in a short period of time is now possible.
In addition, by studying the reflections, it is possible to pinpoint
the location of site anomalies. The May RMC EMC Chapter meeting(s)
featured not one, not two, not three, but four technical presentations!
On May 13th Lee Hill, in a meeting sponsored by Steward Ferrite,
agreed to deliver "Signal Integrity/EMI Challenges &
Design Solutions - A Seminar." The officers of the RMC EMC
Society wish to extend their thanks for the support of Steward
Ferrite and Lee Hill for agreeing to this impromptu meeting. The
chapter benefited greatly from Lee Hill's excellent presentation
and technical information on ferrites. Lee started the meeting
by summarizing the challenges of EMI and using simple models.
Lee described some typical EMI sources and how to find them. Lee
reviewed some low, broadband and high frequency EMI problems and
went on to some typical EMI fixes. A natural byproduct was a short
discussion on how to avoid EMI problems in the first place as
well as an overview of EMI challenges awaiting the unwary. Lee
then focused very closely on ferrites and how they affected the
EMI noise source model. He discussed some placement tips and shared
some secrets of using ferrites. He then went into a description
of common-mode vs. differential mode current and voltage with
some design trade offs that might have to be considered. Lee then
approached the issue of power bus filtering and some sneaky problems
that lurk in the design shadows. All in all, this was a very comprehensive
review of ferrites and how they might be applied in upfront design.
Thanks Lee! 28 members and non-members of the IEEE were treated
to three presentations at the Rocky Mountain Chapter's May 20th
meeting. The meeting was started by Matt Aschenberg of Echostar
Technologies with a presentation entitled "Predicting the
Future - The GTEM tamed?" In his presentation, Matt addressed
the age old (well ~25 yrs anyway) problem of correlation. All
EMC engineers are familiar with the problems associated with comparing
data between different OATS sites, let alone between a non-traditional
site (such as a GTEM) and an OATS. Mat proposed a new way of looking
at the problem. Instead of trying for a point for point correlation,
why not use statistics to predict the probability of an EUT passing
or failing? The presentation generated a great deal of discussion
and served as a nice warm up for the main event. After a short
break, Dr. Bruce Archambeault, in another example of the stamina
of our Distinguished Lecturers, launched into the mysteries of
EMI in printed circuit boards and that other mysterious technology:
the humble decoupling capacitor. His presentations were titled,
"Avoiding Typical PCB EMI Problems" and "Effective
Power/Ground Plane Decoupling." Bruce focused the group very
strongly on what was really important in EMI - current - not voltage.
Bruce then put up a slide that displayed all the variants around
the word "ground" and stated quite categorically that
the only thing ground was good for was planting potatoes. Bruce
was encouraging us to regard ground as a return path instead.
Multi-layer PCBs typically contain a number of different high
speed signals. Successful routing of all these signals often require
some of the standard EMC "rules" to be violated; for
example, trace density forcing traces to cross splits. A detailed
presentation on the effectiveness of decoupling capacitors then
followed which led nicely to that other myth laden area of EMC:
decoupling. While there has been a lot of attention on this topic,
there is still significant confusion about the best strategy for
decoupling. This part of the talk focused on the sources of noise
that the decoupling capacitors are intended to control, and the
physics involved in the noise propagation, and how to properly
analyze the decoupling capacitor performance. Using simulation,
Bruce showed that the analysis must be performed in both the time
domain and the frequency domain. The frequency domain analysis
is a steady state analysis, determines resonances, and is most
useful for analyzing EMI emissions. The time-domain analysis is
a transient analysis and will help determine how well the current
is delivered to the IC, and ultimately, how large (or small) the
generated noise pulse will become. Real-world examples of measurements,
as well as computer simulations were used to demonstrate the optimal
decoupling strategy. At their June meeting, the Rocky Mountain
Chapter welcomed Chris Kendall of CKC Labs who presented, "EMC
Design Considerations for Military Systems Utilizing High Speed
Commercial Interfaces Such As USB, Firewire, 100 BaseT, DUI and
SERDES." In a different direction from the usual "ITE
centric" EMC presentations, Chris accepted an invitation
to speak to the RMCEMC on Military EMC Design. Many new military
designs, especially those that employ video systems, are utilizing
digital high speed data buses including DVI, Serdes, Fibre Channel,
IEEE 1394 (Firewire), and Ethernet. In some cases, all of the
above are being incorporated into the same system. Because some
of these systems are being located in the cockpit area of the
aircraft, the new designs are expected to meet MIL-STD-461E, RE102,
external limits. Additionally, if the aircraft can be deployed
from aircraft carriers (shipboard board environment), field strengths
as high as 13,000 V/m (this is not a misprint!) may also be imposed.
After a brief summary of the interfaces - so desirable for our
next generation fighters - Chris showed how the high-speed interfaces
have significant emissions and susceptibility issues using simulation
software. Then Chris got onto one of his self avowed favorite
subjects: Grounding and Referencing. Chris addressed the different
grounding theories and discussed the use of shielded cables with
different grounding techniques. Most remarkably, Chris showed
how, in one circumstance, the shielding properties of a coax are
governed mainly by the resistance of the cable. All in all, he
presented a very interesting insight to the complexities of military
Russia (Northwest / St. Petersburg)
Professor Mikerov, the Saint Petersburg AES/IE/C/EMC/PE Joint
Chapter Chair, provided a detailed report on exciting IEEE developments
in NW Russia. The IEEE Russia (Northwest) Section covers a territory
of 1800 thousand square km and has a population of 15 million.
This area includes the Russian Northwest Federal Okrug with the
capital of Saint Petersburg. Although not organized until the
1990's, the first IEEE members worked in Leningrad (St. Petersburg)
before the Second World War. The famous Chief Engineer of Electrosila
Company, Professor Alexander Alexeev, joined the AIEE in the USA
during a business trip to General Electric Corporation in 1929.
However, before 1992, St. Petersburg had only five active IEEE
members. The first IEEE Chapter in St. Petersburg was founded
in 1995 by Professor Sergei Tretyakov from St. Petersburg Technical
University with the financial support from IEEE Region 8. Sergei
Tretyakov was a very active IEEE recruiter and even attempted
to form the St. Petersburg IEEE Section in 1993. The first Chapter
was the Electron Devices (ED)/Microwave Theory and Techniques
(MTT) Joint Chapter, which was transformed to the AP/ED/MTT Joint
Chapter in 1996. At that time, it had 30 IEEE members, including
10 students. IEEE activity in our city was accelerated by the
memorable visit in 1995 of the former IEEE Executive Director
Theodore Hissey (now he is the IEEE Director Emeritus). The first
annual Conference for this new Section took place on 10 June 2003
in St. Petersburg. The colloquium included a scientific session
with 15 papers presented in English. The gathering also included
Section Officers elections and the formal approval of the Section
Bylaws. All papers were published in the "Proceedings 2003"
of St. Petersburg IEEE Members. The conference was held at the
majestic 18th century Shuvalov Palace and was attended by more
than half of the 136 St. Petersburg active members. This meeting
was organized in the frame of the annual St. Petersburg High Technology
Week under the direct patronage of the City Government with the
support from the major St. Petersburg exhibition company RESTEK.
Warm and encouraging greetings were given by Professor Alexander
Gelman (IEEE Communication Society Vice-President) and Professor
Dmitry Puzankov (St. Petersburg Electrotechnical University Rector).
The keynote addresses were followed by meetings that accomplished
very important business for the section: 1. First Section Officers
were unanimously elected: Professor Dmitry Puzankov (St. Petersburg
Electrotechnical University) as the Chair, Professor Alexander
Mikerov (from the same University) as the Vice-Chair, Professor
Alexander Korotkov (St. Petersburg Polytechnic University) as
the Secretary and Dr. Yuriy Sepp (St. Petersburg Electrotechnical
University) as the Treasurer. 2. The Section Bylaws Draft with
small corrections and additions was approved and a 15 members
strong Section Executive Committee was formed. 3. Four St. Petersburg
registered IEEE Chapters and their respective activity was noted.
These Chapters include: ED/MTT/AP (Dr. Margarita Sitnikova), BT/CAS/COM
(Dr. Dmitry Tkachenko), LEOS (Prof. Efim Portnoi) and AES/IE/C/EMC/PE
(Prof. Alexander Mikerov). At the suggestion of IEEE volunteers,
the future formation of four new separate Chapters have been planned:
CAS Chapter (Professor
PEL/IA Chapter (Professor
AES/SP/UFFC Chapter (Professor
C/EM Chapter (Professor
Initiators and future Chairs of these Chapters
(mentioned in brackets) launched Chapter Petition Signature campaigns.
4. The establishment in May 2003 of the first St. Petersburg Student
Branch at Electrotechnical University (Chair: Eugene Pickulin,
Councilor: Dr. Yurij Sepp) was appreciated as the very important
contribution of this University and its Rector Professor Dmitry
Puzankov in the development of the IEEE student activity in the
area. The Constituent Assembly was followed on June 10 and 11
by scientific sessions in English with 17 papers published in
the pre-conference Proceedings 2003 of St. Petersburg Chapters
(in English also). The innovative and future looking direction
of the Session was assisted by the exciting video and audio presentation
of Professor Alexander Gelman covering perspectives of a global
communications development (which will change all our day-to-day
lives) and the important role of the IEEE in this process. We
are very grateful to the IEEE as a whole, and especially to Region
8 and its Director Professor Anthony Davies, for their long and
persistent efforts devoted to the creation of this new IEEE Section.
|An EMC Symposium 2004 Steering Committee
meeting was held on June 18, with support from Vita Feuerstein
of IEEE Conference Management Services.
|The dramatic logo for the 2004 IEEE International
Symposium on EMC to be held in Santa Clara - California's
famous Silicon Valley!
Santa Clara Valley
The April meeting of the SCV Chapter featured a presentation by
Darryl Ray of Apple Computer on the "Design and Construction
of Semi-Anechoic Chambers." Various issues were outlined
for dealing with initial design trade-offs, chamber performance,
procurement and the construction headaches that are often encountered.
Darryl has been involved with building eight EMC labs in recent
years and had plenty of war stories to share with the 47 attendees.
Following the presentation, an open house was held at the new
10-meter semi anechoic chamber that Darryl built for Apple, located
in Mountain View, California. In May, Sudip Das, of Cisco Systems,
gave a presentation entitled "Considerations for Advanced
EMC Design Flow." Sudip outlined a number of key design issues
that EMC and signal integrity engineers now face. These issues
are driven by the 'real world' constraints of insufficient time
and resources. One approach suggested by Sudip was to embed the
design requirements in the CAD tools. This would allow for the
efficient designing of schematics and PCB layouts, preserving
the compliance and SI knowledge-base from one project to another.
The key point was to ensure that none of the design objectives
are overlooked. Approximately 60 people attended the meeting.
The SCV chapter is working very hard on the upcoming 2004 IEEE
International EMC symposium. Monthly steering committee meetings
are being held at Apple Computer in Cupertino, California. Vita
Feuerstein Vita Feuerstein from IEEE Conference Management Services
(CMS) attended the June meeting. Please see our new ad in this
publication. The SCV chapter is now taking a well-deserved break
during the summer months.
|A pleasant, informal dinner preceded
the April meeting of Seatle EMC Chapter.
|Ghery Pettit of Intel, nominations chair
and immediate past chair of the Seattle EMC Chapter (left)
encouraged chapter members to run for office. Pat André
of André Consulting, Inc. (right) was subsequently
successfully elected as the new chair of the Seattle EMC chapter
for 2003-2004. Congratulations Pat!
|Bruce Harlacher of Fischer Custom Communications
presented a contro- versial topic to the Seattle EMC Chapter
members and guests.
|Bruce is shown receiving the cherished
"speaker gift" (a combination laser pointer and
pen) following his thought provoking presentation to the Seattle
The April meeting of the Seattle EMC Chapter featured Bruce Harlacher
of Fischer Custom Communications, Inc., in San Diego, California.
The meeting was held at CKC Labs in Redmond, Washington. Bruce
spoke on "CISPR 22: Radiated and Conducted Emissions Testing
for Information Technology Equipment, What's Happening with the
4th Edition Due August 2003? Plus, Just How Does CISPR Operate?"
Bruce advised that the 4th Edition of CISPR 22 is presently due
to be issued August 1, 2003. CISPR 22 deals with the requirements
for radiated and conducted emissions for Information Technology
Equipment (equipment that transmits/ receives digital data via
wire). Measurement techniques given in CISPR 22 for conducted
common mode emissions testing on AC mains and telecommunications
cables have been an ongoing source of concern and confusion. The
original issue date was intended to be August 1 2001, but was
delayed two years in an attempt to rectify problem areas in CISPR
22. Among the more prominent problem areas were the Impedance
Stabilization Networks (ISNs), non-invasive test techniques (Annex
C of CISPR 22), and the use of ferrite clamps as per Amendment
1 of CISPR 22. The ISNs are intended for use on the telecommunications
cables to simulate network balance (as determined by Longitudinal
Conversion Loss - LCL) and provide a specified common mode impedance
to ground. The non-invasive techniques were to be applied where
an ISN could not be used. The ferrite clamps are to be applied
to cables leaving the test area primarily to enhance test repeatability.
The presentation discussed what has happened in these areas during
the last two years and where things are at present. A brief overview
of the CISPR process was also presented. In May, Dr. Cheung-Wei
Lam of Apple Computer, in Cup-ertino, California and IEEE EMC
Society Distinguished Lecturer presented: "Signal Integrity
Design versus Radiated Emission Control." It being the last
meeting of the 2002/2003 program year, the chapter was treated
to a dinner catered by Tony Roma's. All enjoyed the barbecue beef
sandwiches and chocoholic brownies! Dr. Lam explained that while
it is true that good signal integrity design can help reduce EMI,
it alone is not sufficient to achieve good radiated emission control.
The presentation discussed where designing for one can help the
other and where one may have more stringent or even conflicting
requirements with the other. In today's competitive markets, Dr.
Lam advised that it is important for signal integrity engineers
and EMC engineers to understand each other's need to reduce design
iterations and minimize product costs. For engineers responsible
for both disciplines, an in-depth understanding of the similarities
and differences between the two is even more important. In this
presentation, key signal integrity and EMC concepts were reviewed.
Design considerations in the two disciplines were compared and
contrasted at the chip and PCB levels. The chapter members and
guests present all agreed that Dr. Lam's presentation was excellent
and were eager to have him return next year for a follow up presentation
on this exciting topic. The Chapter will take the summer off and
hold its next meeting in September.
|Mike Bosley of Visteon (right) stopped
by to visit with Mike Hart of Quantum Change EMC Systems at
the SE Michigan's EMC Fest.
|Steve Barnes of Lehman Chambers caught
up on some work when the technical presentation by Dr. Paul
resumed following an afternoon break in the exhibition area.
|The SE Michigan Chapter's EMC Fest 2003
Organizing Committee included, from left, Scott Lytle of Yazaki-North
America, Mark Steffka of General Motors, Janet O'Neil of ETS-Lindgren,
and Kimball Williams of Underwriters Laboratories.
|Scott Lytle of Yazaki (left) dropped
by the Rohde & Schwarz booth at the SE Michigan Chapter's
EMC Fest 2003 to see a product demonstration ably performed
by Sean Emerson of R&S.
|Elite Electronic Engineering is a long
time supporter of the EMC Society and the SAE. Their Steve
Laya is always welcome at these events. Here he enjoys a well-deserved
beverage following a full day of booth duty at EMC Fest 2003
|Herb Kramer of Micro Sales enjoyed booth
duty during the SE Michigan Chapter's EMC Fest 2003. Good
thing he stayed during the reception, as he was present to
win a big raffle prize!
|Mack Davis of ETronic USA (left) managed
to catch a moment of Dr. Paul's time following lunch at EMC
Fest 2003 held at the Dearborn Inn, in Dearborn, Michigan.
|Ever the gracious southern gentleman,
Dr. Clayton Paul, the featured speaker at the SE Michigan
Chapter's EMC Fest 2003, patiently signed copies of his book
during the reception following his full day presentation.
Note the jumbo shrimp on his plate! There was great food offered
at the reception buffet.
|Raffle winners convene during the reception
held following the SE Michigan Chapter's EMC Fest 2003. Shown
from left are Michael Shovels of Yazaki, Alan Moore of Harman
Becker Automotive Systems, Don Yordy of CMP, who donated the
prizes, and Edward Mazorowicz with Alcoa Fujikura Ltd. Automotive
Operations. They received hand held Extech instruments including
a Pen Multimeter, Multipurpose Tool, and a Pocket IR Thermometer
with Laser Pointer. Wow!
|Amplifier Research enjoyed the many visitors
at their booth during the SE Michigan Chapter's EMC Fest 2003.
AR's Ken Shepherd welcomed Nick Grilliot, a local EMC representative,
and Jason Granger of Robert Bosch Corp (from left).
"EMC Fest 2003: A Colloquium and Exhibition" was presented
on Friday, June 6 at the Dearborn Inn in Dearborn, Michigan. The
featured speaker was the famed Dr. Clayton Paul of Mercer University
in Georgia. Dr. Paul presented "The Fundamentals of EMC"
to some 100 engineers representing such companies as General Motors,
Ford Motor Company, DaimlerChrysler, Valeo, Visteon, Denso, Yazaki-North
America, and Underwriters Laboratories. In addition to the full
day presentation by Dr. Paul, vendors of EMC products and services
held an exhibition. The SE Michigan Chapter of the IEEE EMC Society
sponsored this event. The highlight of the event was the reception
in the exhibition area. This followed the tutorial and featured
a lavish buffet of jumbo shrimp, among other delectable items.
Dr. Paul was present to personally autograph copies of his book
"Introduction to EMC" that was used as the basis for
the tutorial. It was a full and exciting day with the tutorial,
the exhibition with over 15 companies participating, and the reception
in the exhibition area. Many thanks to lunch sponsors Lehman Chambers
and Schaffner EMC and to reception sponsors Amplifier Research
and Rohde & Schwarz for contributing to the success of this
event. We're sure Herb Kramer of Micro Sales wishes to thank the
chapter for the excellent raffle prize he won during the reception:
a new digital camera! Greg Pianczk of AM General Corporation (his
company manufactures the Hummer) also won big during the chapter
sponsored raffle: he won a gift certificate to Best Buys! Other
raffle prize winners were Don Yordy of CMP who won a "Signal
Solution Kit" courtesy of Fair-Rite Products Corporation,
and Edward Mazorowicz of AFL Automotive Operations, Alan Moore
of Harman/Becker Automotive Systems, and Mike Shovels of Yazaki
who each won a hand held Extech instrument.
Ramesh Abhari reports that the IEEE Toronto Electromagnetics and
Radiation Joint Chapter (AP-S/MTT-S/EMC-S) had two meetings during
the month of April, 2003. On April 8th, Professor Safieddin Safavi-Naeini
from the University of Waterloo (Waterloo, Canada) gave a lecture
on "Fast Computational Methods for Complex Micro-electronic
and Photonic Packages and Interconnects." During the next
April meeting, Professor Jacob Gavan, Dean of the School of Electrical,
Electronic and Communication Engineering, Holon Academic Institute
of Technology (Holon, Israel) gave a presentation entitled, "Radio
Systems Techniques for Enhancing Energy Efficiency and Reducing
Interference and Radiation Hazards." Ramesh also announced
that the IEEE Toronto Section is celebrating its centennial year.
The Toronto Section is the first section of the American Institute
of Electrical Engineers (AIEE) formed outside the Unites States
in 1903. Many events are currently being planned to celebrate
this unique occasion. To find out more about these activities,
please visit the following link: http://ewh.ieee.org/r7/toronto/centennial/index.html
Twin Cities (Minnesota)
Curt Sponberg, Chapter Chair, reports that the Twin Cities Chapter
will hold its first meeting in July since hosting the 2002 EMC
symposium. The featured speaker will be Dan Hoolihan who will
be giving a 'warm-up' run of the CISPR EMC standards presentation
that he will be giving at the IEEE Boston Symposium in August.